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December 2nd, 2024 — Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s leading contract chipmaker, today announced the commencement of equipment installation for its groundbreaking 2-nanometer fabrication facility in Kaohsiung, Taiwan. This milestone marks a significant acceleration of the project, with installation beginning six months ahead of schedule.
Kaohsiung Mayor
December 2nd, 2024 — Vishay Intertechnology, a global leader in the design, manufacture, and sale of discrete semiconductors and passive electronic components, has announced a significant £51 million (approximately $61.2 million EUR) investment in its Newport Vishay semiconductor facility in Wales. This investment, supported by a £5 million grant from
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The Korean government today announced a comprehensive 14 trillion won ($10 billion USD) policy financing package to bolster its semiconductor industry amid growing global uncertainties. This initiative aims to support chip material, component, and equipment manufacturers, as well as fabless companies, facing increased trade risks.
The announcement comes in
ATLANTA, GA, November 28, 2024 — Silicon Creations, a global leader in high-performance analog and mixed-signal intellectual property (IP) is pleased to announce a strategic partnership with Interex Semiconductor. Through this collaboration, Interex Semiconductor will serve as the sales representative for Silicon Creations’ full portfolio of IP solutions across India, providing
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Shanghai, China – November 29, 2024–VeriSilicon (688521.SH) today announced a strategic partnership with LVGL, the leading open-source graphics library for embedded systems, to support VeriSilicon’s low-power 3D and VGLite 2.5D GPU technology within the LVGL library. This partnership aims to optimize performance and expand graphic processing capabilities for a wide
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GlobalFoundries (GF), a leading semiconductor manufacturer, has been awarded up to $1.5 billion in funding under the US CHIPS and Science Act. This significant investment, part of GF’s larger $13 billion plan to expand its US production capacity over the next decade, will bolster domestic chip production and address critical
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OpenAI CEO Sam Altman is leading a $150 million funding round for Rain AI, a semiconductor startup aiming to rival Nvidia’s dominance in the AI chip market. This investment, valuing Rain AI at $600 million, follows a $25 million seed round in 2022 where Altman was a major investor. Rain
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BRANFORD, Conn. and BLOOMINGTON, Minn. – November 20, 2024 – Quantum-Si Incorporated (Nasdaq: QSI) (“Quantum-Si,” or “QSI”), The Protein Sequencing Company™ and SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, announced today they will jointly expand their relationship to support the development of Proteus, Quantum-Si’s next-generation platform designed to transform proteomic research.
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Cadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system chiplet. This innovation marks a pivotal advancement in chiplet technology, showcasing Cadence’s commitment to driving industry-leading solutions through its chiplet architecture and framework.
The First System Chiplet
In a significant leap forward,
Embedded non-volatile memories (eNVM) are memory blocks that are directly integrated semiconductor fabrication on the same die. Since eNVM memories are non-volatile, the data is retained even when the power is off. In addition, eNVMs are reprogrammable and erasable multiple times. Compared to external non-volatile memory technologies, eNVMs have lower
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