March 24, 2025 – Taiwan Semiconductor Manufacturing Company (TSMC), the world’s leading semiconductor foundry, is making significant strides in its 2nm process technology, paving the way for its adoption in Apple’s iPhone 18 family, expected in the second half of 2026.
Recent reports indicate that TSMC has been steadily improving its 2nm trial production yields. TF International Securities analyst Ming-Chi Kuo noted on X that Apple’s A-series chipset, anticipated for the iPhone 18, will leverage this advanced lithography. This aligns with revised expectations from GF Securities’ analyst Jeff Pu, who initially projected the A20 chip to be mass-produced on TSMC’s 3nm ‘N3P’ node.
“TSMC’s progress in 2nm production is a testament to their continued leadership in semiconductor technology,” said [Your Name/Spokesperson Title]. “We are committed to pushing the boundaries of innovation to deliver cutting-edge solutions to our customers.”
TSMC’s initial trial production yields for 2nm reached 60 percent approximately three months ago. Given the company’s current trajectory, it is projected to reach a production capacity of 50,000 2nm wafers by the end of 2025. With its Baoshan and Kaohsiung facilities fully operational, TSMC anticipates a potential output of 80,000 units, sufficient to meet the anticipated demand for the 2nm process.
To further encourage adoption of the 2nm technology, TSMC is actively exploring cost-reduction strategies. The company is reportedly launching its ‘CyberShuttle’ service in April, enabling customers to evaluate their chips on the same test wafer, thereby reducing development costs. This initiative aims to attract a broader range of clients to the 2nm process, solidifying TSMC’s dominance in the foundry business.
