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Sept. 25, 2025 –
SUNNYVALE, Calif. — — Synopsys, Inc. (Nasdaq: SNPS) announced today its ongoing close collaboration with TSMC to deliver multi-die solutions, encompassing advanced EDA and IP products, that support TSMC’s leading-edge processes and packaging technologies, driving innovation in AI chip and multi-die design. The 3DIC Compiler exploration-to-signoff platform and IP, tuned for
proteanTecs®, a global leader in advanced analytics for semiconductor health and performance monitoring, today announced the successful silicon-proven validation of its innovative IP-based health and performance monitoring technology at TSMC’s industry-leading 2nm (N2P) process node. The company is a member of the TSMC IP Alliance Program, a key component of
Read MoreLONDON & TORONTO, Sept. 24, 2025 –
Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, today announced the successful tapeout of the industry’s leading 64 Gbps UCIe™ die-to-die (D2D) IP subsystem on TSMC’s 3nm process technology. Building on its 36
Read MoreSept. 24, 2025 – CAMPBELL, Calif. – Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP for accelerating semiconductor creation, today announced that NanoXplore, a French provider of radiation-hardened system-on-chip (SoC) FPGA technology, has licensed Arteris’ FlexGen smart NoC IP for its space designs. FlexGen will be used in the development
Read MoreSept. 23, 2025 –
EnSilica and Codasip announce strategic partnership to bring CHERI cybersecurity to automotive, critical national infrastructure, defence and aerospace applications
Oxfordshire, United Kingdom and Munich, Germany – EnSilica, a fabless supplier of mixed-signal and digital ASICs, and Codasip, a provider of functionally-safe and cyber-resilient RISC-V CPUs, announces
Lawrenceville, GA , Sept. 18, 2025 – Silicon Creations, a leading provider of precision IP for advanced SoC design, today announced its 1000th production FinFET tapeout at TSMC, alongside the immediate availability of a comprehensive library of IP on TSMC’s advanced N2P process node. The N2P offering includes a full suite of PLLs and clocking IP, such as free-running
Read MoreIn an unexpected twist in the semiconductor world, two longtime rivals—Nvidia and Intel—have struck a deal that some are calling historic. On September 18, 2025, Nvidia announced it would invest $5 billion in Intel, buying common stock at $23.28 per share and acquiring roughly a 4–5% stake in the company.
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HYDERABAD, India, Sept. 16, 2025 — Cyient Semiconductors, a leader in custom ASIC/ASSP and intelligent power solutions, announced a strategic partnership with Anora, a global provider of semiconductor test, testability, and validation services. The collaboration brings together complementary strengths to provide comprehensive, end-to-end solutions for semiconductor product development.
Under this
Aalter, Belgium, September 18, 2025 – Sofics®, a world leading innovator of physical layout and design focused on built-in robustness of integrated circuits that demand superior power-performance-area (PPA), today announced its official inclusion in the GlobalFoundries (GF) GlobalSolutions™ Ecosystem, further expanding its reach across GF’s diverse technology platforms.
This interview features Martin Sallenhag, CEO, at RoodMicrotec, part of Microtest Group.
Can you describe your company’s founding vision and how it has evolved to address the changing landscape of the semiconductor industry?
RoodMicrotec was founded in 1969 and has been a strong partner for European