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Woodcliff Lake, New Jersey — April 12, 2023 — Semiconductor intellectual property provider CAST today announced that design services provider APlabs, Inc., has chosen CAST IP for a new automobile system-on-chip APlabs is developing for a major Korean automaker.
Repeat customer APlabs most recently licensed these cores from CAST
Grenoble, France – April 12, 2023 – Tiempo Secure and GreenWaves Technologies are proud to have demonstrated how a Secure Element brings additional security in a project supported by the French Government, the community of communes Grésivaudan and the Auvergne Rhone Alpes Region. While in classical architecture, developers of SoCs (System-on-Chips)
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FO packaging revenue was US$1.86 billion in 2022. Yole Intelligence, part of Yole Group, expects it to have a CAGR of 12.5% through 2028, reaching US$3.8 billion. UHD FO will experience the fastest growth across all market classes, with a CAGR of 30%, growing from US$338 million in 2022 to
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Nuremberg, Germany, March 14, 2023–VeriSilicon (688521.SH) today announced its collaboration with Microsoft on Windows 10 IoT Enterprise platforms including hardware accelerators and long-term support for powerful embedded platforms. Leveraging VeriSilicon’s embedded software design capability and decades of experience in launching successful products, the company is enabling embedded applications developers and
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Mar. 13, 2023 —- According to TrendForce’s latest survey of the global foundry market, electronics brands began adjusting their inventories in 2Q22, but foundries were unable to rapidly adapt to this development because they reside in the more upper portion of the supply chain. Moreover, revising procurement quantities of long-term foundry contracts
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Grenoble, France – March 8, 2023 – As security is increasingly the central issue of any SoC (System on Chip) development, for example taking into account initiatives like the Cyber Resilience Act, Tiempo Secure has decided to enrich the RISC-V community with security expertise by developing a new version of its
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Woodcliff Lake, New Jersey — March 8, 2023 — Semiconductor intellectual property provider CAST today announced the immediate availability of a new digital audio transceiver IP core that provides both Inter-IC Sound (I2S) and Time-Division Multiplexed (TDM) interfaces.
The new I2S-TDM I2S/TDM Multichannel Audio Transceiver has critical features and
Woodcliff Lake, New Jersey — March 3, 2023 — Semiconductor intellectual property provider CAST today announced the immediate availability of a new deeply embedded, low-power RISC-V processor IP core and enhancements to its functional safety RISC-V processor IP core.
New Low-Power Embedded RISC-V Processor
The BA5x™ RISC-V Deeply Embedded
SAN JOSE, California – Mar 01, 2023 – Omni Design Technologies, a leading provider of high-performance, low-power mixed-signal Intellectual Property (IP) solutions today announced that it has received ISO 9001 certification for the design and development of high performance, ultra-low power IP cores.
Omni Design’s objective is to provide customers
The top 10 global original equipment manufacturers (OEMs) decreased their chip spending by 7.6% and accounted for 37.2% of the total market in 2022, according to preliminary results by Gartner, Inc. Global inflation and recession pressures sharply weakened demand for PCs and smartphones in 2022, impacting global OEMs production.
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