Get the semiconductor daily news directly to you by subscribing to our email list. For ASIC designer and managers, staying updated with the latest news, technologies, and trends is crucial. Here are the lastest news from the semiconductor industry.
Oct. 24, 2024 —- The latest investigations by TrendForce reveal that Chinese foundries are set to drive the bulk of mature process capacity growth in 2025, thanks to China’s domestic IC substitution policies. It is estimated that the capacity of the world’s top 10 mature process foundries will increase by 6%
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Oct. 24, 2024 — Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s leading dedicated independent semiconductor foundry, today confirmed that it has halted shipments to a client after discovering that chips manufactured for that client ended up in products produced by Huawei Technologies. This action follows the company’s mid-October discovery and
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MALTA, N.Y. and EINDHOVEN, Netherlands, October 23, 2024– GlobalFoundries (Nasdaq: GFS) (GF) and NXP Semiconductors (NASDAQ: NXPI) today announced collaboration to drive next-generation solutions across a range of end markets including automotive, IoT and smart mobile devices. This collaboration leverages GF’s 22FDX® process technology platform and global manufacturing footprint to
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Arm Holdings Plc has terminated its architectural license agreement with Qualcomm Inc., ending Qualcomm’s ability to use Arm’s intellectual property for chip design. The termination, reported by Bloomberg, follows a 60-day notice from Arm. This action escalates an existing legal dispute between the two companies, set to begin in Delaware
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Shanghai, China, October 22, 2024–VeriSilicon (688521.SH) today announced that its DeWarp Processing IP DW200-FS has achieved ISO 26262 ASIL B automotive functional safety certification. The certificate was issued by TÜV NORD, an international inspection and certification institution.
VeriSilicon’s DW200-FS IP leverages advanced pixel mapping algorithms and cache-based data prefetch architecture,
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Wolfspeed, Inc. have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $750 million in proposed direct funding under the CHIPS and Science Act. The proposed funding would support the construction of a new silicon
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Imagine a world where electronic devices are exponentially more powerful yet astonishingly compact. This is the promise of 2.5D packaging, an innovative approach to semiconductor design. It’s reshaping the landscape of computing, from smartphones to servers.
In the realm of electronics, understanding the building blocks is key.
[Santa Clara, USA], [October 21st, 2024] – MosChip® Technologies is now an AI/ML design partner under Renesas RZ partner ecosystems, delivering intelligent solutions based on Renesas RZ/V series of MPUs.
MosChip® Technologies is a semiconductor design and product engineering services company with expertise in SoC design, systems, software, mobility, connectivity,
Taiwan Semiconductor Manufacturing Company (TSMC) today announced that customer inquiries for its next-generation 2nm process are exceeding even those for its already successful 3nm technology. This exceptional demand underscores the industry’s confidence in TSMC’s technological leadership and its ability to meet the rapidly growing needs of the AI and high-performance
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Seoul, South Korea, Oct 23, 2024—Chips&Media (C&M), a global leader in video codec IP and application-specific NPU IP, today announced the WAVE6 Gen2+ series, a new multi-standard video codec hardware IP based on the next-generation video codec IP platform WAVE6.
The WAVE6 Gen2+ series is a newly designed IP
