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In this first part of a 2-part blog series, we look at defining worst case conditions, focusing specifically on device power.
With great power, comes great responsibility…
With each new technology node especially FinFET, the dynamic conditions within a chip are changing and becoming more complex in terms of process
In its Global Wafer Capacity 2020-2024 report, IC Insights breaks down the world’s installed monthly IC wafer capacity by geographic region (or country). Figure 1 shows the installed IC capacity by region as of December of 2019.
To clarify what the data represents, each regional number is the total installed monthly
Phison, the market leader in NAND Flash controllers chips and IPs for SSD, PCIe, SD, eMMC, ONFi, UFS & USB Consumer, Embedded & Enterprise applications has signed an agreement with T2M-IP, the world’s largest independent global semiconductor IP provider, to act as a global representative and business development partner of
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Meylan, FRANCE – June 22, 2020 – IC’Alps, French expert in design and supply of application specific integrated circuits (ASIC), today announced the launch of its new website.
https://www.icalps.com is a one-stop destination for microelectronics experts and newbies with a product innovation requiring integration of electronic functions. The website
One of the most common factors that can have a lasting impact on any given semiconductor device is heat. Any logic circuit or electronic device requires a power supply to drive the function of its parts. While most of this power is used up for basic logic functions and signal
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IC Insights released its June Update to the 2020 McClean Report earlier this month. This Update included a 2018-2024 IC database that segmented the IC market by major product type including Consumer, Auto, Computer, Industrial, Communications, and Government/Military end-use applications in the Americas, Europe, Japan, China, and Asia-Pacific regions.
Over the past 21 years, the
This interview was held with Koen Verhaege, CEO of Sofics.
Tell me a bit about your background? How did you first get started with your company?
I graduated from the University of Leuven, Belgium, with a degree in microelectronics in 1990 and started my professional career at
Cambridge, UK, 16 June 2020:
Agile Analog, a leading provider of semiconductor analog IP, today announced that they have worked with EnSilica, a leading fabless design house focused on custom ASIC design and supply services, to both fabricate and test their latest analog IP products, and to validate that their
“Fan-out packaging continues to evolve, establishing a new market class, UHD Fan-Out,” asserts Favier Shoo, Technology & Market Analyst at Yole Développement (Yole). “Being actively explored and validated as one of the high performing and multi-die packaging platforms, Fan-Out Packaging is breaking through into new applications in 5G and HPC. In the Fan-Out Packaging: Technologies
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Plymouth, UK, 10th June 2020
Moortec today announced an addition to its deeply embedded monitoring portfolio, the Distributed Thermal Sensor (DTS) on TSMC N5 process technology. Moortec’s highly granular DTS offers a 7x area reduction in comparison to some standard in-chip thermal sensor solutions, and also supports high accuracy