Find ASIC Vendors
Browse Semiconductor Services
ASIC Design
IC Layout
ASIC Verification
Semiconductor Foundries
IC Packaging
IC Testing
IC Supply Chain
IC Qualification
IC Failure Analysis
Browse IP Vendors
IOs and Library IP
ESD
GPIO
Standard Cell
Memories and PHY IP
Antifuse
CAM
DDR
EEPROM
eFuse
Flash Controller
NAND Flash
OTP
RAM
ROM
SD
SDRAM Controller
SRAM Controller
CPU and Peripherals IP
Clock Generator
CPU
DMA Controller
DSP
Interrupt Controller
IO Controller
LCD Controller
NoC
Peripheral Controller
Receiver/Transmitter
Security
Timer/Watchdog
Analog and Mixed Signal IP
ADC
AFE
Amplifier
Clock Synthesizer
CODEC
DAC
DC/DC
DLL
Oscillator
PLL
Power Management
RF Modules
Temperature Sensor
Voltage Reference
Voltage Regulator
I/F Controller and PHY IP
DisplayPort
AMBA
FireWire
HDMI
I2C
Interlaken
JESD204B
MIPI
PCI
SATA
USB
V-by-One
Wireline Communication IP
Datacom
Error Correction
Ethernet
HDLC
MODEM
Optical
Telecom
Wireless Communication IP
802.11
802.16
Bluetooth
CDMA
GPS
LTE
NFC
Other
Verification IP
AMBA
Memory
MIPI
PCIe
USB
Multimedia IP
Audio Decoders
Audio Encoders
Audio Other
Video Decoders
Video Encoders
Video Other
Get 3 Price Quotes From
ASIC Design Companies
Semiconductor Foundries
IC Packaging
IP Core Vendors
IC Test Houses
Tools
ASIC Price Calculator
IC Package Price Estimator
Die Per Wafer Calculator
Semipedia
Ask a Question
Home
ASIC Design
ASIC Verification
Foundries
IC Packaging
IC Testing
Turnkey
IC Qualification
Failure Analysis
ASIC Blog
2144 Views
BiCMOS
Bipolar and CMOS devices on the same die.
Recent Stories
Silicon Wafer
Semiconductor Wafer Installed Capacity 2020
Amkor Factory Intelligence Enables Industry 4.0
SiPearl and Open-Silicon Research Collaborate to Accelerate Custom Silicon for High Performance Computing (HPC) Applications
Enabling AI Vision at the Edge
SECURE-IC AND MOSCHIP ANNOUNCE STRATEGIC PARTNERSHIP TO PROVIDE TURNKEY ASIC SOLUTIONS WITH EMBEDDED SECURITY FOR EDGE APPLICATIONS
The Emergence of 2.5D Custom SoCs and Chiplets in AI and HPC Applications
yieldHUB chosen by growing semiconductor company
Find Vendors
IP Cores
Find ASIC Vendors
Keywords
Category
All
ASIC Design
IC Layout
ASIC Verification
Foundries
IC Packaging
IC Testing
Turnkey
IC Qualification
Failure Analysis
Find IP Vendors
Keywords
Category
All
IOs and Library IP
Memories and PHY IP
CPU and Peripherals IP
Analog and Mixed Signal IP
I/F Controller and PHY IP
Wireline Communication IP
Wireless Communication IP
Verification IP
Multimedia IP
Multimedia IP
Get Price Offers From
ASIC Design Houses
Wafer Foundries
Chip Packaging
IC Testing
IP Core Vendors
FPGA Design
Welcome New Vendors
Silicon Craft Technology
Chips&Media
Akronic
Shanghai Peilun Semiconductor
Caliber Interconnect Solutions
Answer a Question
Wafer Price
FIB operation
What is Clock Domain Crossing in ASIC design?
“hard bumps” vs "soft bumps"
Small than WLcsp
Recent Semipedia Items
Application Specific Integrated Circuit
CDMA IP Core
Semiconductor Wafer
Graphics Double Data Rate (GDDR) IP Core
Power Management IP Core
Recent Posts
Silicon Wafer
Semiconductor Wafer Installed Capacity 2020
Amkor Factory Intelligence Enables Industry 4.0
SiPearl and Open-Silicon Research Collaborate to Accelerate Custom Silicon for High Performance Computing (HPC) Applications
Enabling AI Vision at the Edge
Most Popular Blog Posts
Wafer Capacity by Feature Size Shows Strongest Growth at <10nm
2020F Top 15 Semiconductor Sales Leaders Including Foundries
eMemory NeoFuse IP Qualified on GLOBALFOUNDRIES Advanced High Voltage Platform for OLED Applications
Pure-Play Foundry Sales by Region 2020F
Unit-Level Traceability for Automotive Customers
Tools
ASIC Price Calculator
IC Packages Price Calculator
Die Per Wafer Calculator
We use cookies to ensure that we give you the best experience on our website. If you continue without changing your settings, we'll assume that you are happy to receive all cookies from this website.
Okay, thanks
