Digital Hardware Design Engineer III – TeraWave

Blue Origin is seeking a Digital Hardware Design Engineer III to join the TeraWave team, which focuses on developing a satellite communications network capable of delivering high-speed data globally. This role involves designing complex mixed-signal printed circuit board assemblies (PCBAs) for space communication systems, ensuring reliability and performance in harsh environments.

Responsibilities:

• Design complete board-level electrical systems including power distribution and high-speed digital interfaces.
• Perform component research and selection considering performance, availability, and cost.
• Create detailed electrical schematics using ECAD tools, ensuring manufacturability and reliability.
• Conduct signal integrity analysis for high-speed interfaces using simulation tools.
• Design robust power distribution networks for FPGAs and high-speed data converters.
• Specify and design impedance-controlled transmission lines for digital and RF signals.
• Analyze crosstalk, EMI/EMC, and grounding strategies for mixed-signal boards.
• Collaborate with PCB designers on layout guidance and routing constraints.
• Generate and maintain Bills of Materials (BOMs) and manage component lifecycle.
• Support board bring-up, debugging, and design validation testing.
• Create test plans for board-level functional verification.
• Interface with engineers to translate requirements into hardware specifications.
• Conduct design reviews and generate technical documentation.

Qualifications:

• B.S. in Electrical Engineering, Computer Engineering, or related field with 5+ years of PCB design experience.
• Proficiency with PCB design tools (Altium Designer, Cadence Allegro, or similar).
• Strong understanding of signal integrity principles for high-speed digital design.
• Experience with controlled impedance design and PCB stackup optimization.
• Knowledge of EMI/EMC best practices and IPC standards.

Skills:

• Experience with PCB layout for FPGAs and mixed-signal designs.
• Experience with RF/microwave PCB design using high-frequency laminates is preferred.
• Knowledge of power integrity analysis tools and thermal management techniques.
• Understanding of design for manufacturing (DFM) and design for test (DFT) principles.
• Familiarity with MIL-STD or NASA standards for PCB design.