Blog

Global Memory Market to Exceed $190 Billion in 2025, Fueled by HBM and AI Growth

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Lyon, France – June 2025 – Yole Group, a leading market research and strategy consulting firm, today announced new findings projecting that the global memory market will reach nearly $200 billion in revenue by the end of 2025, significantly outpacing earlier forecasts. This surge is driven by unprecedented demand for

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AWS Chips Away at Nvidia’s Lead with Rising Demand for Custom AI Processors

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SEATTLE — June 18, 2025
Amazon Web Services (AWS) is seeing clear results from its ambitious custom silicon strategy, as growing adoption of its Trainium and Graviton chip families starts to erode Nvidia’s long-standing dominance in AI infrastructure.
 
In recent months, AWS has reported strong momentum for its internally

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Texas Instruments to Invest More Than $60 Billion to Strengthen U.S. Semiconductor Manufacturing

press release wafer fab

allas, TX — June 18, 2025 — Texas Instruments Incorporated (Nasdaq: TXN) today announced plans to invest more than $60 billion in building and expanding semiconductor manufacturing facilities in the United States—marking one of the largest investments in domestic chip production in American history.
 
The multiyear initiative will span

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X-FAB Expands 180nm XH018 Process with New Isolation Class for Enhanced SPAD Integration

press release gpt

Tessenderlo, Belgium – Jun 19, 2025

 

X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, has released a new isolation class within its 180nm XH018 semiconductor process. Designed to support more compact and efficient single-photon avalanche diode (SPAD) implementations, this new isolation class

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CAST Launches Multi-Channel DMA IP Core Ideal for Streaming Applications

press release

Woodcliff Lake, New Jersey — June 19, 2025 — Semiconductor intellectual property core provider CAST has introduced a new direct memory access (DMA) IP core that alleviates a system’s host CPU from the resource-intensive task of managing data transfers between system memory and multiple peripherals with streaming interfaces.
 
The

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Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry

June 17,2025 — SAN JOSE, Calif.— Cadence (Nasdaq: CDNS) today announced an expansion of its collaboration with Samsung Foundry, including a new multi-year IP agreement to broaden Cadence® memory and interface IP solutions in Samsung Foundry’s SF4X, SF5A and SF2P advanced process nodes. Furthering their ongoing technology collaboration, the companies are leveraging

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