Woodcliff Lake, NJ — September 8, 2020 — Silicon intellectual property provider CAST, Inc. and developer Fraunhofer IPMS today announced a new option for their popular CAN 2.0 and CAN FD Controller IP Core that adds support for the evolving CAN XL standard.
CAN XL is a new data
As expected, most IC suppliers experienced weaker demand and generally poor sales results in the first half of this year due to the Covid-19 pandemic and strained U.S./China trade relations. However, as reported in IC Insights’ August Update to the 2020 McClean Report, some key IC suppliers believe that the second half
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This interview was held with: Murilo Pilon Pessatti, CEO of Chipus Microelectronics.
Tell me a bit about your background? How did you first get started with Chipus?
I am an Electrical Engineer with a MSEE in Analog IC design. I studied in Brazil at São Paulo
An often-overlooked part of chip design is Verification according to Sondrel as designing the front end of a chip is generally perceived as being the more interesting part. However, as Susan Mack, a Senior Engineering Manager at Sondrel, disagrees: “Verification is a very important part of the chip design process
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Which semiconductor R&D outsourcing model is suitable in times of Covid-19 and the US-China trade war? In the first part, I take a look at seven developments that will impact the semiconductor engineering services industry in 2020. In the second article (part 2) I provide a hands-on concept
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Belgium, August 24, 2020 – Sofics bvba (www.sofics.com), a leading semiconductor integrated circuit IP provider announced that its TakeCharge® Electrostatic Discharge (ESD) portfolio is silicon proven on TSMC’s advanced 5nm process technology. More than 100 fabless companies use Sofics solutions to enable higher performance, higher robustness while reducing design time
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