IC Insights released its June Update to the 2020 McClean Report earlier this month. This Update included a 2018-2024 IC database that segmented the IC market by major product type including Consumer, Auto, Computer, Industrial, Communications, and Government/Military end-use applications in the Americas, Europe, Japan, China, and Asia-Pacific regions.
Over the past 21 years, the
This interview was held with Koen Verhaege, CEO of Sofics.
Tell me a bit about your background? How did you first get started with your company?
I graduated from the University of Leuven, Belgium, with a degree in microelectronics in 1990 and started my professional career at
Cambridge, UK, 16 June 2020:
Agile Analog, a leading provider of semiconductor analog IP, today announced that they have worked with EnSilica, a leading fabless design house focused on custom ASIC design and supply services, to both fabricate and test their latest analog IP products, and to validate that their
“Fan-out packaging continues to evolve, establishing a new market class, UHD Fan-Out,” asserts Favier Shoo, Technology & Market Analyst at Yole Développement (Yole). “Being actively explored and validated as one of the high performing and multi-die packaging platforms, Fan-Out Packaging is breaking through into new applications in 5G and HPC. In the Fan-Out Packaging: Technologies
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Plymouth, UK, 10th June 2020
Moortec today announced an addition to its deeply embedded monitoring portfolio, the Distributed Thermal Sensor (DTS) on TSMC N5 process technology. Moortec’s highly granular DTS offers a 7x area reduction in comparison to some standard in-chip thermal sensor solutions, and also supports high accuracy
As part of its May Update to the 2020 McClean Report, IC Insights compiled a list of semiconductor companies that have provided 2Q20 sales guidance. The list included companies from across all geographic regions and all product categories.
Because of uncertainty regarding the impact of Covid-19 on business in the second half of