Woodcliff Lake, NJ — August 6, 2020 — Silicon intellectual property provider CAST, Inc. today announced a new version of its HDLC/SDLC IP core that helps avionics system developers achieve compliance with the DO-254 standard at the most stringent Design Assurance Level, DAL-A.
The new core variant was developed
This interview was held with: Steve Beckers, VP at imec
Tell me a bit about your background. How did you start at imec/imec.IC-link?
With 37 years in the semiconductor industry, I consider myself a veteran. I started my career at Alcatel Microelectronics in 1983 and worked there
Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today launched its next generation IoT SoC development platform, called Ariel™, which is built on UMC’s 40uLP logic process combined with Infineon’s SONOS eFlash technology. Compared with its predecessor, the 55nm Uranus+™ platform, the Ariel platform demonstrates a 35% reduction
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CAEN, France – July 13, 2020—Presto Engineering, an ASIC design and outsourced operations provider to semiconductor and Internet of Things (IoT) device manufacturers, announced today the grand opening of its new Caen Hub in France. The facility will provide IC test, qualification, and test production services primarily for communications, automotive,
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In this first part of a 2-part blog series, we look at defining worst case conditions, focusing specifically on device power.
With great power, comes great responsibility…
With each new technology node especially FinFET, the dynamic conditions within a chip are changing and becoming more complex in terms of process
In its Global Wafer Capacity 2020-2024 report, IC Insights breaks down the world’s installed monthly IC wafer capacity by geographic region (or country). Figure 1 shows the installed IC capacity by region as of December of 2019.
To clarify what the data represents, each regional number is the total installed monthly