Hsinchu, Taiwan, R.O.C., May 15, 2020 – TSMC (TWSE: 2330, NYSE: TSM) today announced its intention to build and operate an advanced semiconductor fab in the United States with the mutual understanding and commitment to support from the U.S. federal government and the State of Arizona.
This facility,
Cambridge, UK, 12 May 2020: Agile Analog, a leading provider of semiconductor analog IP, today announced Palma Ceia SemiDesign, a provider of communication chips and IP for WiFi HaLow and Cellular NB-IoT applications, has selected Agile Analog’s data converter and power management IP for its next-generation of WiFi and cellular IoT
Read MoreIC Insights will release its May Update to the 2020 McClean Report later this month. This Update includes a discussion of the 1Q20 IC industry market results, an updated quarterly forecast for the remainder of this year, and a look at the top-25 1Q20 semiconductor suppliers. The top-10 1Q20 semiconductor suppliers are covered in this
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SAN JOSE, Calif. & HOD HASHARON, Israel– May 6, 2020 — Omni Design Technologies, a leading provider of high-performance, low-power mixed-signal Intellectual Property (IP) solutions, today announced it has appointed Satris Group as its sales representative in Israel. As the demand for Omni Design’s IP portfolio grows in Israel, Satris will
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Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced its SoCreative!V™ SoC development platform based upon Faraday’s A500 SoC in UMC’s 28HPC process. The platform features an ARM Cortex-A53 Quad core with up to 1.4GHz clock rate; delivering an all-in-one solution with multiple, extendable, high-speed
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This is a guest post by Richard McPartland, Technical Marketing Manager, Moortec
Chip designers working on advanced nodes typically include a fabric of sensors spread across the die for a number of very specific reasons. In this, the second of a three-part blog series Richard McPartland, Moortec’s Technical Marketing Manager