September 2, 2019 — Moortec Semiconductor Ltd, providers of complete In-Chip PVT (Process, Voltage and Temperature) Monitoring Subsystems announced today that InnoGrit has chosen Moortec’s 28nm thermal sensing solution to optimise performance and increase reliability for InnoGrit’s recently announced Shasta and Shasta+ SSD controllers aimed at client applications such as consumer electronics
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This interview was held with TRIOULEYRE Jean-Luc, CEO & cofounder of IC’Alps.
Tell me a bit about your background? How did you first get started with IC’Alps?
I started my career as a digital engineer developing FPGA for what became the WIFI. A wonderful experience in
Despite an expected slowdown in growth this year and in 2020, the CMOS image sensor market is forecast to continue reaching record-high sales and unit volumes through 2023 with the spread of digital-imaging applications offsetting weakness in the global economy and the fallout from the U.S.-China trade war. CMOS image
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Santa Clara, Calif. August 26, 2019 – GLOBALFOUNDRIES (GF), the world’s leading specialty foundry based in the United States, today filed multiple lawsuits in the U.S. and Germany alleging that semiconductor manufacturing technologies used by Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) infringe 16 GF patents. The lawsuits were filed today in
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This interview was held with Pascal Barioulet, Managing Director, Elsys America.
How did you first get started with your company?
I joined Elsys Design, an electronic systems design and software house, at its creation in 2000 to build and develop our business in the South of
Belgrade, Serbia – August 22nd, 2019 – HDL Design House, provider of digital, analog, and back-end design and verification services and products in numerous areas of SoC and complex FPGA designs, today announced the launch of its easily expandable, reusable and flexible SoC IoT Platform using the Arm® Corstone™ foundation IP package. The solution
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