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IC’Alps joins Arm Approved Design Partner program to better support customers with ASIC development

Meylan, FRANCE – OCTOBER 08, 2019 – IC’Alps, the French one-stop shop ASIC partner offering custom Integrated Circuit development and supply, today announced it has been appointed an Arm® Approved Design Partner.
 
The Arm Approved Design Partner program is a global network of design service companies endorsed by Arm.
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Dialog Semiconductor to Acquire Creative Chips adding Industrial IoT Products to its Portfolio

London, United Kingdom – October 7, 2019 – Dialog Semiconductor plc, a leading provider of power management, charging, AC/DC power conversion, Wi-Fi and Bluetooth® low energy technology, today announced it has signed a definitive agreement to acquire Creative Chips GmbH, a prominent supplier of Integrated Circuits (ICs) to the Industrial

TSMC Files Complaints Against GlobalFoundries in U.S., Germany and Singapore for Infringement of 25 Patents to Affirm its Technology Leadership and to Protect Its Customers and Consumers Worldwide

Hsinchu, Taiwan R.O.C., Oct 1, 2019 – TSMC, the world’s leading global innovator in semiconductor manufacturing, filed multiple lawsuits on September 30, 2019 against GlobalFoundries in the United States, Germany and Singapore for its ongoing infringement of 25 TSMC patents by at least its 40nm, 28nm, 22nm, 14nm, and 12nm node

HDL Design House Appoints Frank Werner as Worldwide Sales Director

Belgrade, Serbia – October 1st, 2019 – HDL Design House, provider of digital, analog, and back-end design and verification services and products in numerous areas of SoC and complex FPGA designs,  announced the appointment of Frank Werner as Worldwide Sales Director, effective immediately. With more than 25 years of experience in different

The Ultimate Guide to Lead Frame

Lead Frame Overview
 
A lead frame is a generic term for a type of (mostly) low-cost IC package assembly used for DIL types packages as well as PLCCs and QFNs.
 

The frame is typically made of a thin layer of copper, though other materials, such as aluminum

Sofics releases pre-silicon analog I/O’s for high-speed SerDes for TSMC N5 process technology

Belgium, September 26, 2019 – Sofics bvba (www.sofics.com), a leading semiconductor integrated circuit IP provider announced that it has expanded its TakeCharge® Electrostatic Discharge (ESD) and Analog I/O portfolio with solutions for TSMC’s N5 process technology. The cells enable high speed and high frequency interfaces.
 
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