The 10 largest suppliers of analog ICs accounted for 60% of worldwide analog sales last year, or $36.1 billion, compared to nearly 61% in 2017, or about $33.0 billion, according to IC Insights’ 2018 rankings of leading semiconductor companies. The April Update to IC Insights’ 2019 McClean Report ranks the top 50 semiconductor
Read MoreCoreHW, a Finnish fabless semiconductor company offering state-of-the-art full custom IC turnkey solutions, IP and design services as well as own IC products, today announces its intention to enter into a long-term supply chain partnership with RoodMicrotec, a leading independent company for semiconductors supply and quality services.
Mr. Tomi-Pekka
This article provides an overview and description of a typical IC layout process. Its describes the various steps within IC layout and the relationship between each step.
IC layout refers to the backend design cycle. If there’s just one aspect that distinguishes the backend design from frontend design, then
OPENEDGES Technology, Inc., the world’s leading supplier of Memory Subsystem IP including Network On-Chip (NoC) and DDR Controller today announced that ASICLAND has licensed OICTM NoC Interconnect IP and OMCTM DDR Controller IP for artificial intelligence, data center, automotive & other applications.
ASICLAND is a leading design services company who provides
Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, will be exhibiting at ChipEx on May 13th in Tel Aviv, Israel. Sankalp Semiconductor’s booth will be displaying the company’s capabilities in digital, analog and mixed signal, custom layout, standard cell development, IO solutions,
Read MoreMoortec today announced the delivery of its In-Chip Monitoring solution on TSMC 7nm FinFET process to the new Arm® Neoverse™ N1 System Development Platform (SDP). As market leaders, Moortec supported integration and utilization of its process, voltage, and temperature (PVT) sensing subsystem technology to the platform, enabling the next-generation cloud-to-edge
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