Hsinchu, Taiwan, R.O.C., Aug 5, 2018 – TSMC today provided an update on the Company’s computer virus outbreak on the evening of August 3, which affected a number of computer systems and fab tools in Taiwan. The degree of infection varied by fab. TSMC contained the problem and found a solution.
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IP-Maker announces the availability of a NVMe Host reference design, to be showcased at Flash Memory Summit, in Santa Clara, on August 7 to 9. It highlights the integration of the NVMe Host IP from IP-Maker in a powerful FPGA, able to manage data transfer with a Gen3 x4 NVMe
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Facebook is doing it, Google is doing it, even Amazon and Bosch are doing it. They have started designing ASICs (Application Specific Integrated Circuit, aka SoCs, ICs, chips). In fact, system companies are becoming the new ASIC designers and manufacturers. If you are a non-silicon company, this paper will help
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This interview was held with Karel Masařík, Founder and Chief Executive Officer at Codasip, Ltd.
Tell me a bit about your background. How did you first get started with your company?
Codasip was born a decade ago out of my PhD work at the Technical University of Brno. I
Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, has appointed Sathish Kumar Ganesan in the key position of Vice President Engineering for IP Business. In this capacity, Sathish will be responsible for IP development and related engineering services. He has 16+ years
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Amkor Technology announced today it has partnered with Mentor to release Amkor’s SmartPackage™ Package Assembly Design Kit (PADK), the first in the industry to support Mentor’s High-Density Advanced Packaging (HDAP) design process and tools. Amkor’s award-winning High-Density Fan Out(HDFO) process can now be used in conjunction with Mentor’s software to deliver
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