Sales of automotive electronic systems are forecast to increase 7.0% in 2018 and 6.3% in 2019, the highest growth rate in both years among the six major end-use applications for semiconductors. Figure 1 shows that sales of automotive-related electronic systems are forecast to increase to $152 billion in 2018 from
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Andes Technology Corporation, a leading supplier of small, low-power, high performance 32-/64-bit embedded CPU cores, and INVECAS, a provider of leading edge IP solutions, design services and turn-key ASIC capabilities today announced a partnership. The aim of the collaboration is to win RISC-V-based SoC designs for advanced Fab processes. Andes
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The TOLL package is a highly efficient space-saving package featuring extremely low Rds(on) and strong thermal performance making it well suited for high current and high voltage applications. It meets an existing JEDEC package outline, is 30% smaller and 50% thinner than a DDPAK package. The TOLL package leads are designed with wettable flanks
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IC Insights’ November Update to the 2018 McClean Report, released later this month, includes a discussion of the forecasted top-25 semiconductor suppliers in 2018 (the top-15 2018 semiconductor suppliers are covered in this research bulletin). The Update also includes a detailed five-year forecast of the IC market by product type (including dollar volume, unit shipments,
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Since the development of the first ASIC, the IC package was a mean to protect the silicon die and to provide means to PCB connectivity. Back then, the IC package was large and introduced various electrical parasitic.
WLCSP package is one of the latest and most impressive invention of
This interview was held with Randy Caplan, CEO at Silicon Creations.
Tell me a bit about your background?
[randy] I’ve actually spent my whole career in integrated circuit design. I started right at the peak of the dot-com era, and followed the advice of the “experts” at the