Flex Logix™ Technologies, Inc., the leading supplier of embedded FPGA (eFPGA) IP and software, announced today that three interconnect patents have been issued to Cheng Wang, co-founder of Flex Logix. These patents highlight the breakthrough interconnect technology that enables Flex Logix to design eFPGA in a new process node in ~six
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Since the global economic recession of 2008-2009, the IC industry has been on a mission to pare down older capacity (i.e., ≤200mm wafers) in order to produce devices more cost-effectively on larger wafers. The spree of merger and acquisition activity and the migration to producing IC devices using sub-20nm process technology
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G-ray Medical Sàrl, a Neuchâtel startup, is currently developing an ultra-high performance detector dedicated to medical applications and in particular mammography. These ultra-high performance detectors will be made in partnership with CSEM, based on G-ray’s revolutionary lateniumTM technology. Centred on particle-counting X-ray imaging, this unique solution is set to improve
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Dream Chip Technologies announced today record power efficiency of its ADAS System-on-Chip (SoC) for automotive computer vision applications, fabricated on GLOBALFOUNDRIES’s 22FDX® semiconductor process at the foundry’s Fab 1 facility in Dresden, Germany.
The SoC was created in close cooperation with Arm, ArterisIP, Cadence, GLOBALFOUNDRIES, and INVECAS as part
This is an interview with Claude Joseph Cloutier, President and Chief Executive Officer with XtremeEDA Corporation.
Tell me a bit about your background? How did you first get started with your XtremeEDA?
I started out my work career in 1978 as an Air Navigator in the Canadian Air Force
Andes Technology Corporation, the leading Asia-based supplier of small, low-power, high performance 32/64-bit embedded CPU cores, today announced that Solid State System Co., Ltd. (3S) has licensed the mid-range AndesCore™ N903A for the SSS6131 USB 3.1 Gen 1 flash controller chip. The chip is being designed into USB flash drives
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