Leuven, December 20th 2016 – AnSem NV, the leading analog, RF and mixed-signal ASIC solutions company expands its operations, opening an office in Enschede, The Netherlands.
The Dutch design center will be headed by Clemens Mensink, who has over 20 years of IC experience. AnSem BV will be located
Belgrade, Serbia – December 20th, 2016 – HDL Design House, a provider of high-performance digital and analog IP cores and system-on-chip (SoC) design and verification services, has joined the ARM® Approved Design Partner program, through which leading SoC design houses are recognized by ARM as accredited partners in specific technologies
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Prior to 2008, the 200mm silicon wafer was used in more cases for manufacturing ICs than any other wafer size. However, since 2008, the majority of IC fabrication has taken place on 300mm silicon wafers. Rankings of silicon manufacturers by installed capacity for each of the wafer sizes are shown
Read MoreAccording to Business Korea Samsung Electronics is considering a reorganization of the System LSI division in order to systematically grow the system semiconductor business. The company is planning to separate the design and manufacturing sectors in the business unit and divide or spin off it to fabless and foundry business
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SANTA CLARA, DECEMBER 15th 2016 – ELSYS America celebrates its 1st anniversary in the Silicon Valley. ELSYS America is built upon its mother company’s, ELSYS Design, 15+ years experience in integrated circuit design, partnering with all the major semiconductors companies based in Europe; it has successfully extended this offer to
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MOUNTAIN VIEW, Calif., Dec. 12, 2016 /PRNewswire/ — CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, today announced that Maria Marced, President of TSMC Europe BV., has been appointed to its board of directors, as an independent non-executive director, effective December 8, 2016.
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