QFN package is the most successful package type today. Offering low price, excellent performance and small size, it is an ideal package for many applications.
QFN package comes in different size and different lead count. This infographics shows the most popular body size and lead count provided by leading OSAT
Some years ago the term “System On a Chip”, shortened to “SOC”, was coined to describe chips that integrated into themselves the functions of several other chips in an electronic system. The point of this was obviously to reduce cost and form factor in situations where the cost and effort
Read More
This is an interview with Oliver King about understanding your ASIC’s age. As Moortec’s CTO, Oliver has been leading the development of compelling in-chip monitoring solutions to address problems associated with ever-shrinking System-on-Chip (SoC) process geometries. An analogue and mixed signal design engineer with over a decade of experience in low
Read More
Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and
IP provider, and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303)
(“UMC”), a leading global semiconductor foundry, today announced the
availability of Faraday’s 12.5Gbps programmable SerDes PHY IP on UMC’s 28HPC(U)
process technology. The success of Faraday’s 12.5G SerDes PHY
According to Gartner, the total average IC design cost for a 14nm chip is about $80 million, compared to $30 million for a 28nm planar device. Whilst many vendors will remain at 28nm, the ‘big guys’ have forged ahead with migrating to lower technology nodes. At the leading edge, R&D
Read More
STMicroelectronics, (NYSE: STM) , a global semiconductor leader serving customers across the spectrum of electronic applications, today announced that it has acquired ams’ (SIX: AMS) assets related to NFC and RFID reader business. ST has acquired intellectual property, technologies, products and business highly complementary to its secure microcontroller solutions serving mobile devices,
Read More