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Advanced packaging revenue dropped 9% in Q1 2024, but recovery is expected in 2024

market research

According to Yole Group, in the Advanced Packaging Market Monitor Q2 2024, advanced packaging revenue reached US$10.2 billion in Q1 2024. This quarter is anticipated to be the weakest of the year, with an 8.1% revenue decline from the previous quarter due to the seasonality that typically impacts the back-end business

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Faraday Adds Video Interface IP to Support All Advanced Planar Nodes on UMC Platform

press release

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that its MIPI D-PHY and V-by-One (VBO) PHY IP portfolios now support processes that range from 55nm to 22nm on UMC platform. Faraday has shipped over 100 million video interface IP solutions for AIoT, industrial,

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Avnet ASIC Team Launches Ultra-Low-Power Design Services for TSMC’s 4nm Process Node

news

Avnet ASIC, a division of Avnet Silica, an Avnet company (NASDAQ: AVT), today announced that it has launched its new ultra-low-power design services for TSMC’s cutting-edge 4nm and below process technologies. These services are designed to enable customers to achieve exceptional power efficiency and performance in their high-performance applications, such as blockchain

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HCLTech and Arm collaborate on custom silicon chips optimized for AI workloads

NOIDA, India, May 27, 2024—HCLTech, a leading global technology company, and Arm, a leading technology provider of processor IP, announced their collaboration to augment custom silicon chips that support AI-driven business operations. 
 
The partnership will bring to market solutions that enable semiconductor manufacturers, system OEMs and cloud services providers to enhance the

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Place and Route: Ultimate Guide

Place and route is an important part of the ASIC design flow and act as both mapmaker and builder within the silicon landscape, determining where components reside and how they connect while meeting stringent technical requirements. Its role is pivotal; without effective practices here, the most innovative chip designs could

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Demand from AMD and NVIDIA Drives FOPLP Development, Mass Production Expected in 2027–2028

market research

Jul. 3, 2024 —- In 2016, TSMC developed and named its InFO FOWLP technology, and applied it to the A10 processor used in the iPhone 7. TrendForce points out that since then, OSAT providers have been striving to develop FOWLP and FOPLP technologies to offer more cost-effective packaging solutions.

  

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