Due to the growth of the semiconductor business, the wider adoption of Cu pillar solutions and the introduction of Flip Chip technology for LED and CMOS Image Sensors (CIS) applications, the Flip Chip market is expending. Under this context, more and more industrial companies including OSATs, IDMs IC foundries and
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IC Insights will release its November Update to the 2015 McClean Report later this month, and its new 2016 edition of The McClean Report in January. The November Update will include the latest IC market forecasts by product type through 2019, a detailed forecast for semiconductor industry capital spending by company for 2016, and a ranking of
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Google is taking the next necessary steps towards the mobile phone market and plans to start developing and producing CPU chips for enabling a complete mobile phone eco system, to be combined with its successful Android operating systems.
Google has started in recent weeks talks with several processors
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As technology evolves, more functionality is being added on SOCs. At same time, pressure is building up to reduce operating and standby power. Today the market is focused on reducing power in wide spectrum of SOCs from CPUs, GPUs and Mobile not just IOT/wearable SOCs. Battery powered SOCs require
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In past few months, while interacting with customers, I came across a couple of cases where the VIP played a spoilsport. In one case, the IP & VIP were procured from the same vendor during the early phase of standard protocol evolution. One of the key USPs of the product was
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“The fact that TSMC is interested in advanced packaging isn’t “new news”, comments Jean-Christophe Eloy, President & CEO, Yole Développement (Yole). He adds: “Over the last few years TSMC has significantly invested in flip-chip copper pillar capacities (Source: 2015 Flip Chip Business Update report, October 2015) and 3DIC stacking for
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