“The fact that TSMC is interested in advanced packaging isn’t “new news”, comments Jean-Christophe Eloy, President & CEO, Yole Développement (Yole). He adds: “Over the last few years TSMC has significantly invested in flip-chip copper pillar capacities (Source: 2015 Flip Chip Business Update report, October 2015) and 3DIC stacking for
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While the entire semiconductor industry is excited about FinFET and FDSOI process technologies, there is one semiconductor technology that considered by engineers as “the process for real men” and it’s called BiCMOS.
BiCMOS process is essentially a combination of Bipolar transistor and CMOS transistors, it offers many technical advantages
Sony has announced that its semiconductor unit will now be separated from the company’s core business. The strategic decision arrived in order to allow the Japanese electronic firm to focus its resources and attentions on the Devices and the Digital image divisions. This last one in particular, in fact, has
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Interesting and surprising cooperation: Intel is developing the modem chip to be used in the next iPhone’s devices. To meet Apple’s tough and tight schedule IBM has allocated a staff of about 1,000 people. Intel’s foothold in what is expected to be the world’s best-selling smartphone has a dramatic importance
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According to the latest reports, Temasek and China’s Jiangsu Changjiang Electronics Technology Co Ltd (JCET) just signed a $1.8 million deal that will allow JCET to acquire STATS ChipPAC from Temasek.
The decision followed the new internal financial policy at Temsasek which aims to diversify the
PMC-Sierra, a provider of data center chips, will soon be part of the radio components manufacturer Skyworks after signing a $2billion purchase agreement.
Notwithstanding the fact that this deal might sound strange to many, the decision occurred as a simple product expansion and a chance to widen the buying