ASIC Blog - Page 33 of 208

Faraday Continues Expanding Its Ethernet Solutions for Networking Demands in ASIC

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, announced that its Gigabit Ethernet PHY has been silicon proven on UMC’s 28HPC+ process and is now available for new ASIC SoC designs and IP licensing. This new IP, based on 28nm node, provides the benefits of

DA-Integrated Announces New Location

OTTAWA, Canada, May, 2022 – DA-Integrated is adding additional test capacity and constructing a new facility in order to accommodate continued growth. The property at 27 Iber Road is in the heart of Canada’s microelectronics sector. The new location includes a 3,200 sq ft class 10,000 clean room with class 100

Silex Insight’s eSecure Root of Trust is now supporting ZAYA microcontainers for enhanced security

May 3, 2022 — Silex Insight, a leading provider of cryptographic IP solutions, today entered into a partnership arrangement with leading IoT security company ZAYA, who delivers a secure OS containerisation technology for microcontrollers, called ZAYA μContainers. The ZAYA μContainers can be added to Silex Insight’s eSecure Root of Trust module

Top 10 Semiconductor Sales Leaders 1993-2021

IC Insights’ 2Q Update to The McClean Report 2022 will be released in May. It presents an analysis of the marketshare of the major semiconductor suppliers excluding the pure-play foundries (Figure 1). While there is a small amount of double-counting effect due to the IDM foundry revenue included in the figures, it is

2016-2022 Semiconductor Wafer Capacity Trends

IC Insights’ February 1Q Update to The McClean Report 2022 includes an overview of IC industry capacity and wafer start trends from 2002 through 2026. This bulletin provides a brief summary.

The volatile nature of the IC industry is reflected by large swings in annual wafer starts. Over the past five years, for

MOSCHIP Announces High Speed Serial Trace Probe (HSSTP) PHY With Link Layer in 6nm

Santa Clara, CA, – April 18, 2022 – MosChip Technologies, a semiconductor and system design services company, unveils today enhanced simplex High Speed Serial Trace Probe (HSSTP) PHY macro with link layer supporting data transfer capabilities of up-to 12.5Gbps per lane in 6nm FinFET technology. MosChip has over a twenty-year track

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Faraday Continues Expanding Its Ethernet Solutions for Networking Demands in ASIC

DA-Integrated Announces New Location

Silex Insight’s eSecure Root of Trust is now supporting ZAYA microcontainers for enhanced security

Top 10 Semiconductor Sales Leaders 1993-2021

2016-2022 Semiconductor Wafer Capacity Trends

MOSCHIP Announces High Speed Serial Trace Probe (HSSTP) PHY With Link Layer in 6nm

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Blog

Faraday Continues Expanding Its Ethernet Solutions for Networking Demands in ASIC

DA-Integrated Announces New Location

Silex Insight’s eSecure Root of Trust is now supporting ZAYA microcontainers for enhanced security

Top 10 Semiconductor Sales Leaders 1993-2021

2016-2022 Semiconductor Wafer Capacity Trends

MOSCHIP Announces High Speed Serial Trace Probe (HSSTP) PHY With Link Layer in 6nm

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