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Avnet ASIC Team Launches Ultra-Low-Power Design Services for TSMC’s 4nm Process Node

news

Avnet ASIC, a division of Avnet Silica, an Avnet company (NASDAQ: AVT), today announced that it has launched its new ultra-low-power design services for TSMC’s cutting-edge 4nm and below process technologies. These services are designed to enable customers to achieve exceptional power efficiency and performance in their high-performance applications, such as blockchain

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HCLTech and Arm collaborate on custom silicon chips optimized for AI workloads

Partnership

NOIDA, India, May 27, 2024—HCLTech, a leading global technology company, and Arm, a leading technology provider of processor IP, announced their collaboration to augment custom silicon chips that support AI-driven business operations. 
 
The partnership will bring to market solutions that enable semiconductor manufacturers, system OEMs and cloud services providers to enhance the

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Place and Route: Ultimate Guide

Asic design flow

Place and route is an important part of the ASIC design flow and act as both mapmaker and builder within the silicon landscape, determining where components reside and how they connect while meeting stringent technical requirements. Its role is pivotal; without effective practices here, the most innovative chip designs could

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Demand from AMD and NVIDIA Drives FOPLP Development, Mass Production Expected in 2027–2028

market research

Jul. 3, 2024 —- In 2016, TSMC developed and named its InFO FOWLP technology, and applied it to the A10 processor used in the iPhone 7. TrendForce points out that since then, OSAT providers have been striving to develop FOWLP and FOPLP technologies to offer more cost-effective packaging solutions.

  

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Faraday Joins Intel Foundry Accelerator Design Services Alliance to Target Advanced Applications

Faraday Technology Corporation (TWSE: 3035), a leader in ASIC design services and IP solutions, announces joining the Intel Foundry Accelerator Design Services, marking a significant milestone in advancing ASIC design solutions for next-generation applications, including artificial intelligence (AI), high-performance computing (HPC), and AI-enabled vehicle. This participation in the alliance underscores

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High Bandwidth Memory (HBM): Ultimate Guide

HBM presents a significant leap over traditional memory types. Key features such as astonishing memory bandwidth, reduced power consumption, impressive memory capacity, and swift transfer rates distinguish HBM from its predecessors. Understanding these characteristics is essential for appreciating the impact of this cutting-edge technology.
 

 
Embark on a

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