Tenstorrent, a promising artificial intelligence (AI) chip startup, has recently secured $100 million in funding through a successful financing round led by industry giants Hyundai and Samsung. The substantial investment reflects the growing interest and demand for cutting-edge semiconductor technologies that can fuel advancements in AI and 5G technologies. This
Read MoreAnySilicon, the leading marketplace for ASIC service providers, announced today that GF Micro, an independent silicon design company for over thirty years, has partnered with AnySilicon to promote its ASIC development services. As part of the AnySilicon platform, GF Micro will gain access to a full range of online marketing
Read MoreWe had a great pleasure interviewing Sanghyun Kim, CEO of Chips&Media, Inc.
Tell me a bit about your background. How did you first get started with Chips&Media?
After graduating from the university and graduate school in the United States, I started as an engineer at a
SAN JOSE, Calif.– July 20, 2023 — Cadence Design Systems, Inc. (Nasdaq: CDNS) and Rambus Inc. (Nasdaq: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced that they have entered into a definitive agreement for Cadence to acquire the Rambus SerDes and memory interface PHY
Read MoreHsinchu, Taiwan — July 11, 2023 — Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, launched its SerDes (serializer/deserializer) total solution comprises SerDes IP design on UMC 28nm and the corresponding IP advanced (IPA) service which includes IP subsystem integration, PHY hardcore implementation, and signal integrity/power
Read MoreJuly 5, 2023 — EUROPRACTICE Multi-Project Wafer (MPW) services will now offer flexible integrated circuit fabrication from Pragmatic Semiconductor, headquartered in Cambridge, UK. Within the EUROPRACTICE consortium, imec will be the partner that provides customers with access to Pragmatic’s technologies and technical support.
Pragmatic uses thin-film transistor (TFT) technology combined