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CEO Talk: Michael Dube, EVP at Rochester Electronics

This interview was held with Michael Dube, Executive Vice President of Manufacturing Operations and Engineering of Rochester Electronics.
 

 
Tell me a bit about your background? How did you first get started with Rochester Electronics?
 
Sure, let me share a bit about my journey. I kicked off my

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Faraday Announces Plans to Develop Arm-based 64-core SoC on Intel 18A Technology

press release

Faraday Technology Corporation (TWSE: 3035), a leader in ASIC design services and IP solutions, announces its collaboration with Arm and Intel in spearheading the development of a 64-core System-on-Chip (SoC) utilizing Intel 18A technology. This innovative SoC seamlessly integrates Arm® Neoverse™ Compute Subsystems (CSS), delivering unparalleled performance and power efficiency

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SignatureIP launches its new iNoCulator NoC configuration tool with a free trial offer

MILPITAS, CALIFORNIA, UNITED STATES, February 2, 2024 — SignatureIP, the pioneer of next generation NoC tools, has launched its new iNoCulator™ NoC configuration tool with a free trial period of two weeks for customers. The NoC (Network on Chip) is the backbone of a chip that provides the interconnect infrastructure between

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Marquee Semiconductor Engages Industry Veteran Gideon Intrater as Strategic Advisor

news

MILPITAS, CALIFORNIA, UNITED STATES, January 31, 2024 — Marquee Semiconductor, a global leader in chip design solutions, announces it has brought on semiconductor industry veteran Gideon Intrater as a Strategic Advisor. Mr. Intrater brings to Marquee more than 30 years of experience gained through technical, marketing and sales leadership roles at

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Eliyan Sets New Standard for Chiplet Interconnect Performance with Latest PHY Delivering Data Rate of 64Gbps on 3nm Process Using Standard Packaging

SANTA CLARA, Calif. – January 31, 2024 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced the successful tape out of the industry’s highest performing PHY solution for multi-die architectures, achieving bandwidth of 64Gbps/bump on a 3nm process using standard packaging. The

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Intel and UMC Announce New Foundry Collaboration

SANTA CLARA, Calif., and TAIPEI, Taiwan, ROC, Jan. 25, 2024 – Intel Corp. (Nasdaq: INTC) and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced that they will collaborate on the development of a 12-nanometer semiconductor process platform to address high-growth markets such as mobile,

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