NORTH READING, Mass.–(February 3, 2025 )– Teradyne, Inc. (NASDAQ:TER), a leading supplier of automated test solutions, and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a global semiconductor leader in power systems and IoT, today announced they have entered into a strategic partnership to advance power semiconductor test.
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Mannheim, Germany, January 30, 2025 — EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BeammWave, an innovation leader in mmWave 5G/6G digital beamforming, as a key SerDes IP supplier for its next gen communication ASIC development portfolio on GlobalFoundries’ (GF) 22nm FD-SOI process
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Munich, Germany, and Oxford, UK – 28th January, 2025 — Codasip GmbH and RED Semiconductor International Ltd have signed a Memorandum of Understanding (MoU) to collaborate on developing advanced AI acceleration technologies.
Under the MoU, RED will leverage the Codasip Studio processor design tools to integrate its VISC technology as an accelerator for Codasip
The semiconductor industry is poised for a significant expansion in 2025, with plans to commence construction on 18 new fabrication plants (fabs). This surge, detailed in SEMI’s World Fab Forecast, reflects the industry’s projected growth to $697 billion in 2025, an 11.2% increase from 2024. While some fabs are slated
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Mont-Saint-Guibert, Belgium, January 28, 2025 – intoPIX, a leading provider of innovative image compression technologies, and PlexusAV, a pioneer in IPMX solutions, are proud to announce the successful interoperability testing between the Plexus P-AVN-4 IPMX JPEG XS FIP transceiver and the new intoPIX Titanium Software Suite. This collaboration highlights the
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SUNNYVALE, Calif., Jan. 21, 2025 /PRNewswire/ — Blue Cheetah Analog Design today announced the successful tape-outs of its next generation BlueLynx™ die-to-die (D2D) PHY on Samsung Foundry’s SF4X 4nm advanced manufacturing process. The latest PHY supports both advanced and standard chiplet packaging with an aggregate throughput exceeding 100 Tbps while
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