System in Package (SiP) is a method used for bundling multiple integrated circuits (ICs) and passive components into a single package, under which they all work together. This contrasts to a System on Chip (SoC), whereas the functions on those chips are integrated into the same die.
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Wafer Level Packaging or WLP, is a type of IC packaging technology that is performed at wafer level. This means that the packaging is applied on whole wafers and wafers are diced only after the packaging is successfully competed. In wafer level packaging, the components used in assembly (such as
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Silex Insight, a leading provider of cryptographic IP solutions, is now extending their offering by launching a high throughput DDR encrypter (100Gbps). The DDR encrypter IP Core module enables on-the-fly encryption and authentication to the external memory. It is highly configurable and may be optimized for various size, throughput, and
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IC Insights’ forecast for the foundry market through 2026 was part of its recently released 1Q Update to the 2022 McClean Report. The Update also included analyses of the top-25 2021 semiconductor suppliers, semiconductor industry capital spending, IC industry capacity, the automotive IC market, and detailed forecasts for the DRAM, flash, MCU, MPU, and analog
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Figure 1 shows that after surging 36% in 2021, semiconductor industry capital spending is forecast to jump 24% in 2022 to a new all-time high of $190.4 billion, up 86% from just three years earlier in 2019. Moreover, if capital spending increases by ≥10% in 2022, it would mark the
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Wafer cost is a critical component of IC cost calculation. Wafer cost is based on 4 main factors: wafer technology node, e.g. 5nm, 65nm, 130nm, etc. Wafer options/features, e.g. all the options required on top of the plain vanilla, e.g. mim cap, flash, high voltage, etc. Wafer volume, e.g. how
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