There have been many debates around the final cost of an IC. Over the years the misconception and failure to agree on what the calculated IC cost would be. The reason for this is that ICs are a simple concept anymore. Technology moves at an extremely fast pace and IC
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It has been almost two decades since the target impedance concept was first proposed for the design of power distribution networks. Both academia and industry have come a long way since then by proposing solutions for managing power integrity in packages and printed circuit boards (PCB). This paper briefly reviews
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Firstly let me ask what strikes your mind first when I say performance?
Intel started designing processors with MHz to GHz frequencies (Improving the performance of course, but if we see the advantage there might be some flaws too). Yes serially it was possible to send and receive the data
Hundreds of jobs are under threat after Texas Instrument announced the closure of its Greenock factory.
TI said it would be closing the fab over the next three years, and moving its operations to fabs in Germany, Japan and Maine, in order to save money. Approximately 400 people are
QFN Package Overview
QFN (Quad Flat No-Lead) is a compact surface-mount IC package with electrical contacts located underneath the package instead of protruding leads. QFN packages offer a small PCB footprint, short electrical paths and efficient heat transfer through an exposed thermal pad, making them widely used for RF, analog,
As semiconductor industry continues on its path to improve its productivity and profitability, the industry faces roadblocks due to huge capital investments with poor RoI. For past few decades ITRS has provided guidance to the research community and associated funding agencies worldwide, in setting up technological challenges and driving progress
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