SAN RAMON, CA, 94582 — January 17, 2024 — YorChip, Inc. announces its first Chiplet for Edge AI applications with IP licensed from Semidynamics, the leader in RISC-V IP based in Barcelona. The Semidynamics High-Performance High-Bandwidth Quad Core IP with 4 Atrevido 423 with V8 SMD VPUs and T16 SMD Tensor
Read MoreTEMPE, Ariz.–(BUSINESS WIRE)–Jan. 16, 2024– Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, and GlobalFoundries (GF), one of the world’s leading semiconductor manufacturers, will officially kick off their strategic partnership in Europe with a ribbon cutting ceremony at Amkor’s Porto, Portugal, facility on January 16, 2024.
Since February 2023, GF
LAS VEGAS—January 8, 2024—Today, HaiLa Technologies Inc., a fabless semiconductor and software company focusing on hyper power-efficient wireless communications system-on-chip solutions for IoT devices, announces availability of the BSC2000 RF Evaluation Chip Development and Demonstration Kits. Presto Engineering, a European leading expert in application-specific integrated circuit (ASIC) design, engineering, and
Read MoreDelivering exceptional throughput, AI-powered encoding, and superb image enhancement for data centers
Las Vegas, USA — January 8, 2024 — VeriSilicon (688521.SH) today unveiled its latest VC9800 series Video Processor Unit (VPU) IP with enhanced video processing performance to strengthen its presence in the data center applications. The newly launched
Transaction brings Cadence skilled system design expertise in delivering end-to-end custom solutions to customers across multiple industries
SAN JOSE, Calif.– January 08, 2024 — Cadence Design Systems, Inc. (Nasdaq: CDNS) announced today that it has acquired Invecas, Inc., a leading provider of design engineering, embedded software and system-level solutions, headquartered
Introduction to Embedded FPGAs
The embedded field-programmable gate array (eFPGA) technology has undergone significant evolution in recent years. eFPGAs serve as a programmable fabric in addition to conventional fixed-function components when they are directly integrated into application-specific integrated circuits (ASICs) or system-on-chips (SoCs). There are various benefits