Category Archives: ASIC Industry Market Trends

Largest IC Product Categories Revenue – 2019F

IC Insights recently released its Mid-Year Update to The McClean Report 2019.  The update included IC Insights’ ranking of the 33 largest IC product categories based on their expected sales and unit shipment volumes for 2019. The 33 IC product categories are those defined by the World Semiconductor Trade Statistics (WSTS) organization. 

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Semi Content in Electronic Systems Forecast to Drop to 26.4% in 2019

In its upcoming Mid-Year Update to The McClean Report 2019 (to be released at the end of July), IC Insights forecasts that the 2019 global electronic systems market will grow 4% to $1,680 billion. In contrast, the worldwide semiconductor market is expected to drop by 12% this year to $443.8 billion after exceeding

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What Is a System-on-Chip? SoC Meaning, Architecture & Examples

CPU chip installed on a computer motherboard

A system on a chip, also known as an SoC, is essentially an integrated circuit or an IC that takes a single platform and integrates an entire electronic or computer system onto it. It is, exactly as its name suggests, an entire system on a single chip. The components that

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Semiconductor Industry Capex History and Forecast 1983-2020

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IC Insights will release its 200+ page Mid-Year Update to the 2019 McClean Report next month.  A portion of the Mid-Year Update will examine semiconductor industry capital spending trends with an industry-wide forecast through 2023.  In addition, the Update will include IC Insights’ capital spending forecast for each of the 32 major spenders for 2019 and

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Worldwide IC Company Market by Location – 2018

IC Insights will release its 200+ page Mid-Year Update to the 2019 McClean Report next month. A portion of the Mid-Year Update will examine the trends for worldwide IC company marketshare by headquarters location.
 
Figure 1 shows the 2018 IDM and fabless company shares of IC sales as well as the total worldwide share of

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CSEM and MIFS demonstrate world-record lows in energy consumption for a microcontroller.

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Neuchatel, 19 June 2019—Combining CSEM’s ultra-low-power ASIC design experience with the Extreme-Low Power (ELP) DDC technology from MIFS enables new world records in power consumption. A complete process design kit, along with a range of mixed-signal silicon IPs, is now available.
 
The phenomenal growth of the Internet of Things

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