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IC Package Types and How to Choose One?

Introduction to Integrated Circuit Packaging

Integrated circuit packaging technologies have evolved throughout the years to the point where hundreds of IC package types are available today.

Most applications will require the more general, single-element packaging for integrated circuits and the other components such as resistors, capacitators, antenna etc.

Understanding CoWoS Packaging Technology

In order to cater to the computing demands for high performance computing (HPC) and artificial intelligence (AI), a need for a scalable package was felt. Chip-on-wafer-on-substrate (CoWoS) refers to the advanced packaging technology that offers the advantage of a larger package size and more I/O connections. It allows 2.5D and

First OSAT in the Middle East: Israel Strengthens Semiconductor Independence by Uniting iNPACK Expertise with ATS Engineering

iNPACK (a PCB Technologies Ltd. Company) and cutting-edge IC packaging and assembly house in Israel, in conjunction with ATS Engineering, a leading IC Test House based in Israel, have announced a transformative collaboration in order to establish the first Outsourced Semiconductor Assembly and Test (OSAT) facility in the Middle East. This pioneering venture aims to

The future of Semiconductor Packaging, Assembly and Test in the European Semiconductor Eco-System

Since mid of last year, our member ESPAT-Consulting is dedicating significant resources to SEMI Europe GmbH in Berlin, Germany, as one of the seven consortium core members of the EU CHIPS ACT driven Horizon Europe – Chips Joint Undertaking (JU) – Coordination and Support Action (CSA) – Project Pack4EU (Link: https://pack4eu.eu/). He is asking

Amkor and GlobalFoundries Cut Ribbon on Strategic Cooperation in Portugal

TEMPE, Ariz.–(BUSINESS WIRE)–Jan. 16, 2024– Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, and GlobalFoundries (GF), one of the world’s leading semiconductor manufacturers, will officially kick off their strategic partnership in Europe with a ribbon cutting ceremony at Amkor’s Porto, Portugal, facility on January 16, 2024.

Since February 2023, GF

Amkor Announces US Advanced Packaging and Test Facility

TEMPE, Ariz.–(BUSINESS WIRE)–Nov. 30, 2023– Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, has announced its plan to build an advanced packaging and test facility in Peoria, Arizona. By the time of full project completion, Amkor projects to invest approximately $2 billion and employ

Category Archives: Packaging

IC Package Types and How to Choose One?

Understanding CoWoS Packaging Technology

First OSAT in the Middle East: Israel Strengthens Semiconductor Independence by Uniting iNPACK Expertise with ATS Engineering

The future of Semiconductor Packaging, Assembly and Test in the European Semiconductor Eco-System

Amkor and GlobalFoundries Cut Ribbon on Strategic Cooperation in Portugal

Amkor Announces US Advanced Packaging and Test Facility

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Category Archives: Packaging

IC Package Types and How to Choose One?

Understanding CoWoS Packaging Technology

First OSAT in the Middle East: Israel Strengthens Semiconductor Independence by Uniting iNPACK Expertise with ATS Engineering

The future of Semiconductor Packaging, Assembly and Test in the European Semiconductor Eco-System

Amkor and GlobalFoundries Cut Ribbon on Strategic Cooperation in Portugal

Amkor Announces US Advanced Packaging and Test Facility

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