Category Archives: Testing

Teradyne and Infineon Announce Strategic Partnership to Advance Power Testing

NORTH READING, Mass.–(February 3, 2025 )– Teradyne, Inc. (NASDAQ:TER), a leading supplier of automated test solutions, and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a global semiconductor leader in power systems and IoT, today announced they have entered into a strategic partnership to advance power semiconductor test.
 
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Foxconn and HCL JV Secures Land for Semiconductor Plant in Uttar Pradesh, India

[Sep 13, 2024] – Foxconn, a leading global electronics manufacturer, and HCL Technologies, a leading Indian technology services company, have taken a significant step towards establishing a semiconductor plant in Uttar Pradesh, India. The joint venture (JV) between the two companies has secured a 30-acre plot of land in Noida, near

CoreHW and Presto Engineering Announce Ground-breaking Collaboration to Advance Global Penetration of Ultra-low-power RF IoT Devices

Meyreuil, France—September 3, 2024— CoreHW, a leading fabless semiconductor company, and Presto Engineering, a European expert in application specific integrated circuit (ASIC) design, engineering, and production services, have announced their successful collaboration in developing the first enhanced low-power radio frequency (RF) 2.4GHz front-end module in an ultra-small and thin wafer-scale

Teradyne Marks 8,000th J750 Semiconductor Test System Shipment

NORTH READING, MA / ACCESSWIRE / May 21, 2024 / Teradyne, Inc. (NASDAQ:TER), a leading supplier of automated test equipment, today announced shipment of its 8,000th J750 semiconductor test platform. This milestone has been achieved with V-Test, a leading outsourced semiconductor assembly and test (OSAT) vendor in China.

 
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First OSAT in the Middle East: Israel Strengthens Semiconductor Independence by Uniting iNPACK Expertise with ATS Engineering

iNPACK (a PCB Technologies Ltd. Company) and cutting-edge IC packaging and assembly house in Israel, in conjunction with ATS Engineering, a leading IC Test House based in Israel, have announced a transformative collaboration in order to establish the first Outsourced Semiconductor Assembly and Test (OSAT) facility in the Middle East. This pioneering venture aims to

Presto and T&W Engineering Announce Long-Term Partnership to Advance Wearable Brain Sensing

Meyreuil, France—November 2, 2023—Presto Engineering, a European leading expert in application-specific integrated circuit (ASIC) design and semiconductor engineering and production services, and T&W Engineering, the leading in-ear electroencephalogram (EEG) wearable device developer and provider of artificial intelligence (AI)-driven EEG reading services, today announced their collaboration to develop an ASIC for measuring