Category Archives: ASIC Design

MosChip selects Cadence tools for the design of HPC Processor “AUM” for C-DAC

moschip cadence

Hyderabad, India — December 11, 2024 — MosChip® Technologies selects Cadence 5nm EDA tools for the design of the High-Performance Computing (HPC) Processor “AUM” for C-DAC.
 
MosChip® Technologies is the first fabless semiconductor company publicly traded in India. It has over twenty-five years of experience designing products and SoCs with

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ASIC supplier ICsense selected for GlobalFoundries’ official design partner network

globalfoundries

Leuven – December 3, 2024 – ICsense, a TDK Group Company and independent subsidiary specializing in the design of Application Specific Integrated Circuits (ASICs), has announced a new partnership with GlobalFoundries (GF), a global leader in semiconductor manufacturing. This partnership through GF’s GlobalSolutions ecosystem aims to streamline access to GF’s semiconductor

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SoC Design Overview

wafer

SoC designs are everywhere in our lives. From smartphones and laptops to smart home devices and automobiles, SoCs power a vast array of electronic devices. The demand for increasingly sophisticated and interconnected devices fuels the rapid growth of the semiconductor industry. SoC design can be found in the following products:
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ST Opens Power Design and Industrialization Centre in Pisa

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STMicroelectronics has opened a power design and industrialisation centre in Pisa in Italy.
 
The centre in Pisa Montacchiello includes a test laboratory and was created in collaboration with the Department of Information Engineering of the University of Pisa. It aims to have about 40 people working on the design and industrialization

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Circuit IC: The Ultimate Guide

Direction uncertainty with a landscape

Integrated circuits (ICs) play a vital role in the functioning of various electronic devices, from simple calculators to complex computers. At the heart of these ICs lies the circuit IC, a complex network of interconnected components that offer various functionally from processing data to transmitting information. In this article, we’ll

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Tessolve to acquire Dream Chip Technologies

November 6, 2024 — Tessolve, a Hero Electronix venture and a leader in semiconductor engineering, has signed a definitive agreement to acquire Dream Chip Technologies, a semiconductor chip design firm headquartered in Germany, for around ₹400 Crore (EUR 42.5 million).
 
This acquisition, which is subject to regulatory approvals, will

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