October 17, 2024 — EnSilica, a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), is pleased to announce that it has been awarded a design and supply contract for a mixed signal controller ASIC to be used in automotive and industrial motorised actuators. The European based client (the
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Introduction to Semiconductor
Semiconductors have a small energy gap between the conduction and valance bands, and their conductivity is between insulators and conductors. At absolute zero temperature, semiconductor materials are pure insulators and gradually increase with temperature. Temperature and doping are the two mechanisms to manage the conductivity of semiconductors.
Meyreuil, France – September 12th – Presto Engineering, a leading European expert in application-specific integrated circuit (ASIC) design, engineering and production services, proudly announces becoming member of the MEDICALPS cluster. This initiative is part of Presto Engineering’s ongoing commitment to understanding the challenges and needs of medical device companies, ensuring continued
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Growing demands in wideband radio and wireless communication deployments are imposing the necessity of a proper radio architecture capable of providing solid performance, more flexibility, in addition to optimal power, size, and cost.
This paper focuses on how direct RF sampling architecture has proved to be a felicitous approach
Avnet ASIC, a division of Avnet Silica, an Avnet company (NASDAQ: AVT), today announced that it has launched its new ultra-low-power design services for TSMC’s cutting-edge 4nm and below process technologies. These services are designed to enable customers to achieve exceptional power efficiency and performance in their high-performance applications, such as blockchain
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Place and route is an important part of the ASIC design flow and act as both mapmaker and builder within the silicon landscape, determining where components reside and how they connect while meeting stringent technical requirements. Its role is pivotal; without effective practices here, the most innovative chip designs could
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