SUNNYVALE, Calif., Jan. 21, 2025 /PRNewswire/ — Blue Cheetah Analog Design today announced the successful tape-outs of its next generation BlueLynx™ die-to-die (D2D) PHY on Samsung Foundry’s SF4X 4nm advanced manufacturing process. The latest PHY supports both advanced and standard chiplet packaging with an aggregate throughput exceeding 100 Tbps while
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SAN JOSE, Calif.— January 21, 2025 — Cadence (Nasdaq: CDNS) today announced it has entered into a definitive agreement to acquire Secure-IC, a leading embedded security IP platform provider. The addition of Secure-IC’s talent and highly complementary, proven portfolio of embedded security IP, security solutions, security evaluation tools and services will
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Woodcliff Lake, New Jersey — January 16, 2025—CAST, a leading semiconductor intellectual property (IP) core provider, is excited to announce the upcoming release of its new KiviPQC™-KEM IP core and invites early adopters to engage in product evaluations. This new IP core implements the Module-Lattice Key Encapsulation Mechanism (ML-KEM) as
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SAN RAMON, CA, UNITED STATES, January 14, 2025 — YorChip, Inc. and Chipcraft announce development of a low cost, low power 8 bit 200Ms/s ADC Chiplet. Currently no ultra-low power devices exist in open market as Chiplets. Designers currently have to license the IP and integrate into a custom SOC while
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In an era where semiconductor technology drives innovation across industries, the importance of effective verification methods has never been more prominent. As designs become increasingly complex, ensuring the integrity and functionality of Intellectual Property (IP) cores is critical for success.
IP verification stands at the forefront of semiconductor design,
SEOUL, South Korea – January 9, 2025 — QUALITAS SEMICONDUCTOR CO., LTD. (hereinafter referred to as “Qualitas”) (KOSDAQ: 432720), a leading provider of high-speed interconnect solutions, has announced the supply of its 4nm PCIe 6.0 PHY IP to VeriSilicon Inc., a global design house.
This agreement was part of