Portland OR – February 6, 2024 — Trilinear Technologies, a leading provider of cutting-edge technologies for display connectivity and semiconductor solutions, is proud to announce its strategic collaboration with key industry partners to support the integration of VESA’s DisplayPort Automotive Extensions (DP AE) into automotive systems. This initiative reflects Trilinear’s commitment
Read MoreMILPITAS, CALIFORNIA, UNITED STATES, February 2, 2024 — SignatureIP, the pioneer of next generation NoC tools, has launched its new iNoCulator™ NoC configuration tool with a free trial period of two weeks for customers. The NoC (Network on Chip) is the backbone of a chip that provides the interconnect infrastructure between
Read MoreSANTA CLARA, Calif. – January 31, 2024 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced the successful tape out of the industry’s highest performing PHY solution for multi-die architectures, achieving bandwidth of 64Gbps/bump on a 3nm process using standard packaging. The
Read MoreSAN RAMON, CA, 94582 — January 17, 2024 — YorChip, Inc. announces its first Chiplet for Edge AI applications with IP licensed from Semidynamics, the leader in RISC-V IP based in Barcelona. The Semidynamics High-Performance High-Bandwidth Quad Core IP with 4 Atrevido 423 with V8 SMD VPUs and T16 SMD Tensor
Read MoreDelivering exceptional throughput, AI-powered encoding, and superb image enhancement for data centers
Las Vegas, USA — January 8, 2024 — VeriSilicon (688521.SH) today unveiled its latest VC9800 series Video Processor Unit (VPU) IP with enhanced video processing performance to strengthen its presence in the data center applications. The newly launched
Introduction to Embedded FPGAs
The embedded field-programmable gate array (eFPGA) technology has undergone significant evolution in recent years. eFPGAs serve as a programmable fabric in addition to conventional fixed-function components when they are directly integrated into application-specific integrated circuits (ASICs) or system-on-chips (SoCs). There are various benefits