Category Archives: IP Cores

Get Access to State-of-the-art reports by SoC Security Experts

Secure-IC offers you the opportunity to get access to its line of State-of-the-art reports, redacted by its Security Experts, daily involved in Research, Development and Consulting activities, with real hands-on knowledge of the covered subjects. The reports contain thorough analysis and essential information that will help readers build up-to-date knowledge

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Talking Sense With Moortec…See No Evil!

This is a guest post by Tim Penhale-Jones, EVP Sales and Marketing, Moortec
 
In the first of this blog trilogy, Talking Sense with Moortec…’Are you listening’, I looked at not waiting for hindsight to be wise after the event, instead make use of what’s available and act ahead of time. Read More

eMemory Provides Intellectual Property for Secure NB-IoT Products

Hsinchu, Taiwan (May 21, 2020) –eMemory, the world’s leading supplier of intellectual property for NVM and security at the semiconductor level, is providing its intellectual property that ensures security in new chips for the narrowband-IoT (NB-IoT) market.
 
NB-IoT is a low-power wide area network (LPWAN) radio technology standard developed to

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Configurable Analog Semiconductor IP Enables Faster IoT Chip Design

Cambridge, UK, 12 May 2020: Agile Analog, a leading provider of semiconductor analog IP, today announced Palma Ceia SemiDesign, a provider of communication chips and IP for WiFi HaLow and Cellular NB-IoT applications, has selected Agile Analog’s data converter and power management IP for its next-generation of WiFi and cellular IoT

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Omni Design Appoints Satris Group as Sales Representative in Israel

SAN JOSE, Calif. & HOD HASHARON, Israel– May 6, 2020 — Omni Design Technologies, a leading provider of high-performance, low-power mixed-signal Intellectual Property (IP) solutions, today announced it has appointed Satris Group as its sales representative in Israel. As the demand for Omni Design’s IP portfolio grows in Israel, Satris will

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Talking Sense with Moortec – In-Die Process Speed Detection

This is a guest post by Richard McPartland, Technical Marketing Manager, Moortec
 
Chip designers working on advanced nodes typically include a fabric of sensors spread across the die for a number of very specific reasons. In this, the second of a three-part blog series Richard McPartland, Moortec’s Technical Marketing Manager

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