Category Archives: Testing

Teradyne – Company Overview

Located in North Reading, Massachusetts, Teradyne is a supplier and developer of automatic test equipment for a number of large companies. The Semiconductor Test and Systems Test Group offers their services to a number of customers, including high profile companies such as Intel, Samsung, and IBM.
 
The name Teradyne

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Advantest – Company Overview

Advantest

One of the leading manufacturers of automatic test equipment, Advantest has proven to be one of the leading lights in the semiconductor industry. In addition, they manufacture measuring instruments that are used in the creation of electronic system. You can find Advantest products used in the creation of digital consumer

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IDDQ Testing

Iddq testing is one of the many ways to test CMOS integrated circuits in production. These circuits are usually tested as a way to find different types of manufacturing faults. Electric faults can be a major hazard and it can even lead to fatalities. This method relies on measuring the

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Scan Test Power Normalization Using Hierarchical Test Flow

Introduction
 
Low power test efforts in SOC design are broadly classified into – fine tuning ATPG patterns, enhancing collaterals for supporting low power ATPG, architecture for low power DFT, improving estimation and correlation. The flow discussed here comes under the category of “fine tuning ATPG patterns”.
 
Currently due

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SoC Manufacturing and Test Trends

Technology Trends
 
Process technology is progressing at a very fast pace and 16/14nm FinFET- based SOCs are available from various fabless companies. Significant investments in the development of advanced technology nodes are being made to ensure that future demands are met. This makes fab utilization of primary importance.

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Overview and Dynamics of Scan Chain Testing

This is a guest post by Naman Gupta, a Static Timing Analysis (STA) engineer at a leading semiconductor company in India.

In accordance with the Moore’s Law, the number of transistors on integrated circuits doubles after every two years. While such high packing densities allow more functionality to be incorporated on

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