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Mechanical Engineer Supporting ASIC Test

Published Date: October 27, 2026
Broadcom, Fort Collins, CO
Job Description:

This mechanical engineering position focuses on developing thermal management and socketing solutions for test and validation PCBs for Broadcom ASIC products, specifically aimed at hyperscale data center applications. The role is integral to advancing Broadcom's market-leading products that support the next generation of AI and cloud storage.

Responsibilities:

  • Collaborate with PCB electrical design engineers to create robust ASIC socket and thermal solutions.
  • Perform mechanical component design and verification using Solidworks.
  • Conduct 3D mechanical extractions from Allegro PCB design software.
  • Interface with device package designers to generate device warpage profiles from simulation data.
  • Measure actual device warpage using high precision profilometry equipment to validate simulations.
  • Manage socket hardware vendors, providing feedback and approving designs.
  • Troubleshoot mechanical and electrical contact issues in lab and test environments.
  • Design and review cooling solutions (air, liquid, cold plate) for test hardware.
  • Evaluate and manage procurement of mechanical and test hardware, including thermal control units and socket resistance measurement platforms.
  • Utilize 3D printing to resolve usability issues.

Qualifications:

  • Bachelor’s Degree in Mechanical Engineering with 8 years of experience or a Master’s Degree with 6 years of experience in semiconductor socket and cooling solutions.
  • In-depth experience using Solidworks.
  • Experience with Ansys Icepack and/or Solidworks FLOW for thermal analysis and simulation.
  • Experience with Ansys mechanical simulation software.
  • Experience managing vendors in the test hardware manufacturing process.

Skills:

  • Strong design ownership and collaboration skills with engineers.
  • Good mechanical prototyping skills and attention to detail.
  • Familiarity with socketing and cooling for high power, high ball-count ASIC devices.
  • Experience with pogo-pin and elastomeric IC socket solutions.
  • Mechanical debugging intuition and proficiency with basic hand tools, micrometers, and calipers.
  • Base knowledge of ATE test hardware mechanical configurations.
  • Familiarity with Keyence profilometry equipment.
  • Ability to manipulate large data sets using Excel or Python scripts.
  • Passion for continuous improvement and commitment to quality output.
  • Strong teamwork and interpersonal skills for managing vendors and internal customers.

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