Semiconductor Latest News

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eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips

Press Release PR

(Hsinchu Taiwan, June 26, 2025) eMemory announced that its one-time programmable (OTP) memory solution, NeoFuse, has achieved qualification on TSMC’s N3P process, an enhanced 3nm process for better power, performance and density. As eMemory’s first OTP IP qualified on the TSMC N3P process, NeoFuse OTP underscores the company’s leadership in providing

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Sofics Delivers Remarkable PPA & R Performance Near Physical Limits on TSMC 2nm Technology

press release

GISTEL, BELGIUM – June 25, 2025 – Sofics bv, a world leading solution provider specializing in physical layout and design, with a focus on the built-in robustness of integrated circuits that demand superior power, performance, and area (PPA), today announced the silicon validation of its IP for TSMC’s cutting-edge

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Creonic’s DVB-S2 and DVB-S2X IP Cores Now Support the New DVB-NIP Standard

press release

Creonic’s DVB-S2 and DVB-S2X IP cores now include support for the new DVB-NIP standard on physical layer — an important step toward seamless integration of satellite and IP-based network technologies.
 
The DVB-NIP standard is designed to facilitate the native transport of IP over satellite networks, extending the capabilities of DVB-S2X by streamlining packet-based

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Semiconductor foundry landscape to transform by 2030

press release wafer

KEY TAKEAWAYS:

Foundry capacity is forecasted to grow at 4.3% CAGR[1] from 2024 to 2030.
Mainland China to lead in foundry capacity by 2030, with 30% of global share.
U.S. players account for 57% of wafer demand but own only 10% of foundry capacity.
Global foundry utilization

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SkyWater Technology Announces Anticipated Closing Date of Fab 25 Acquisition and Receipt of Regulatory Approvals

press release wafer fab

LOOMINGTON, Minn., and AUSTIN, Texas – June 23, 2025 – SkyWater Technology (Nasdaq: SKYT), the trusted technology realization partner, today announced that it expects to complete its previously announced acquisition of Fab 25 on June 30, 2025. The company also confirmed that all required regulatory approvals have now been obtained.
 
The

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Faraday Delivers Latest SerDes IP to Complete Interface Lineup on UMC’s 22nm Platform

news

Hsinchu, Taiwan — June 24, 2025 — Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the availability of its 10G SerDes IP on UMC’s 22nm process technology. Designed to meet the increasing demands of high-speed data transmission, the new SerDes IP supports a broad

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Global Memory Market to Exceed $190 Billion in 2025, Fueled by HBM and AI Growth

market

Lyon, France – June 2025 – Yole Group, a leading market research and strategy consulting firm, today announced new findings projecting that the global memory market will reach nearly $200 billion in revenue by the end of 2025, significantly outpacing earlier forecasts. This surge is driven by unprecedented demand for

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AWS Chips Away at Nvidia’s Lead with Rising Demand for Custom AI Processors

Depositphotos

SEATTLE — June 18, 2025
Amazon Web Services (AWS) is seeing clear results from its ambitious custom silicon strategy, as growing adoption of its Trainium and Graviton chip families starts to erode Nvidia’s long-standing dominance in AI infrastructure.
 
In recent months, AWS has reported strong momentum for its internally

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Texas Instruments to Invest More Than $60 Billion to Strengthen U.S. Semiconductor Manufacturing

press release wafer fab

allas, TX — June 18, 2025 — Texas Instruments Incorporated (Nasdaq: TXN) today announced plans to invest more than $60 billion in building and expanding semiconductor manufacturing facilities in the United States—marking one of the largest investments in domestic chip production in American history.
 
The multiyear initiative will span

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X-FAB Expands 180nm XH018 Process with New Isolation Class for Enhanced SPAD Integration

press release gpt

Tessenderlo, Belgium – Jun 19, 2025

 

X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, has released a new isolation class within its 180nm XH018 semiconductor process. Designed to support more compact and efficient single-photon avalanche diode (SPAD) implementations, this new isolation class

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