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In 2026, Pacific MicroCHIP marks 20 years of ASIC design services and turnkey solutions. We spoke with CTO Denis Zelenin about that journey, the company’s growing range of products—from a 56 GS/s ADC to RF spectrometers—and what customers increasingly expect from custom silicon.
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Advanced packaging has become the place where AI system performance is won or lost. High-end performance packaging revenue is forecast to grow to more than $51 billion in 2031, a 27% CAGR during 2025-2031, with package unit volume expanding at a 33% CAGR and wafer demand at 30%.
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