Semiconductor Latest News

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Faraday Technology Selects Silvaco FlexCAN IP for Advanced Automotive ASIC Design

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SANTA CLARA, Calif. — (BUSINESS WIRE) — March 24, 2025 — Silvaco Group, Inc. (Nasdaq: SVCO) (“Silvaco” or the “Company”), a provider of TCAD, EDA software, and SIP solutions that enable innovative semiconductor design and digital twin modeling through AI software and automation, today announced that Faraday Technology Corporation (TWSE: 3035) a leading provider

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Power Semiconductor Giants amid Struggles: 8,800+ Layoffs as Market Slows and China Emerges

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TrendForce, March 26, 2025 — Once a rising star alongside AI chips, power semiconductors are now feeling the heat from a sluggish EV market. According to ijiwei, citing Nikkei, major players are slashing jobs and pushing back investments, with layoffs topping 8,800.
 
Power semiconductors, vital for EV range and home

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FuriosaAI Rejects $800 Million Acquisition Offer from Meta, Opts for Independent Growth

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SEOUL, SOUTH KOREA – March 25, 2025 – South Korean AI chip startup FuriosaAI has declined an $800 million acquisition offer from US tech giant Meta, choosing instead to pursue its vision as an independent company
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Discussions between FuriosaAI and Meta had been ongoing since early this year, with

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Sarcina Technology launches AI platform To enable cost-effective customizable packaging solutions for AI applications

Palo Alto, CA – 25 March 2025. Sarcina Technology, a global semiconductor packaging specialist, is excited to announce the launch of its innovative AI platform to enable advanced AI packaging solutions that can be tailored to meet specific customer requirements. Leveraging ASE’s FOCoS-CL (Fan-Out Chip-on-Substrate-Chip Last) assembly technology, this platform

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TSMC on Track for 2nm Production, Expected to Power Apple’s iPhone 18 in 2026

March 24, 2025 – Taiwan Semiconductor Manufacturing Company (TSMC), the world’s leading semiconductor foundry, is making significant strides in its 2nm process technology, paving the way for its adoption in Apple’s iPhone 18 family, expected in the second half of 2026.
 
Recent reports indicate that TSMC has been steadily

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Cadence Silicon Success of UCIe IP on Samsung Foundry’s 5nm Automotive Process

21 Mar 2025 – We are thrilled to announce that Cadence has successfully demonstrated first-pass silicon success of its UCIe™ standard package IP on Samsung Foundry’s 5nm automotive process. This milestone underscores our commitment to delivering high-performance, automotive-grade IP solutions that meet the stringent requirements of next-generation automotive and high-performance computing

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Zero ASIC launches world’s first open standard eFPGA product

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Cambridge, MA – March 18, 2025 – Zero ASIC, a U.S. semiconductor startup on a mission to democratize silicon, has announced PlatypusTM, the world’s first open-standard eFPGA IP product. Platypus is the FIRST and ONLY commercial eFPGA IP products with:
 

100% open and standardized FPGA architectures
100% open source

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SoftBank to Acquire Ampere Computing for $6.5 Billion, Doubling Down on AI and Arm Technology

SoftBank Group announced it will acquire Ampere Computing, a Silicon Valley-based startup specializing in Arm-based server chips, for $6.5 billion. The deal, expected to close in the second half of 2025, signifies SoftBank’s increasing investment in artificial intelligence infrastructure and its belief in the growing importance of

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Sofics and Dolphin Semiconductor Announce Strategic Partnership

Belgium and France – March 19, 2025 – Sofics, a leading provider of specialty I/O and on-chip electrostatic discharge (ESD) solutions, and Dolphin Semiconductor, a leading provider of semiconductor IP solutions specializing in mixed signal IP design, today announced a strategic partnership aimed at enhancing integrated circuit (IC) designs for customers

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KiviCore and CAST Release Post-Quantum Cryptographic Key Encapsulation IP Core

Dresden, Germany and Woodcliff Lake, New Jersey — March 19, 2025 — Cryptographic solutions expert KiviCore and semiconductor intellectual property provider CAST today announced the release of a new post-quantum cryptographic IP core, the KiviPQC™-KEM ML-KEM Key Encapsulation IP Core. It enables the quantum-safe exchange of a shared secret key

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