Get the semiconductor daily news directly to you by subscribing to our email list. For ASIC designer and managers, staying updated with the latest news, technologies, and trends is crucial. Here are the lastest news from the semiconductor industry.
Nov-5-2026 — The European Commission has launched the European Chip Design Platform (EuroCDP), backed by €525 million in investment to support a new generation of European semiconductor design companies. The initiative, launched by Henna Virkkunen, Executive Vice-President for Tech Sovereignty, Security and Democracy, is a key part of the EU
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AnySilicon IP Vendor Spotlight: Avionics communication interfaces demand precise timing, dependable data handling and extensive verification. For FPGA design teams, developing these protocol functions from scratch can add significant integration and validation effort.
In this spotlight, Ates Berna, General Manager and Managing Partner of ElectraIC, introduces the company’s
Moving an existing ASIC or semiconductor product to another wafer fab can lower manufacturing cost, improve supply continuity and reduce geopolitical exposure. But a foundry transfer is rarely a simple matter of sending the same masks to a different factory. Here is how to assess technical feasibility, budget
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A semiconductor intellectual property (IP) core becomes useful to a chip design team when the team can install it, understand its behavior, verify its configuration, and connect it to the rest of the system. Delivering the design itself is only part of that handoff. The supporting files determine how much
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Choosing semiconductor intellectual property (IP) is a decision about the entire chip development process. A core may provide the required function yet still create substantial work when its interfaces, timing assumptions, verification models, or physical characteristics do not fit the system.
For an engineering team developing a system-on-chip
ANTA CLARA, Calif. & TEL AVIV, Israel–(BUSINESS WIRE)– Intel Corporation today announced that it has entered into a definitive agreement to acquire Classiq, a leading provider of quantum computing software. The combination of Classiq’s synthesis platform with Intel’s spin-qubit manufacturing and existing software would create a user-friendly full-stack quantum computing
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Looking for a company that can dice 300mm (12-inch) semiconductor wafers ? AnySilicon helps you source wafer-dicing service providers for prototype lots, engineering runs and ongoing production requirements. Share your wafer specifications to identify suppliers with the appropriate equipment, process capabilities and handling experience.
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Custom Arm Processor Integration, ASIC Design and Turnkey SoC Development
Developing a custom Arm-based System-on-Chip (SoC) requires expertise in processor architecture, semiconductor IP integration, RTL design, verification, physical implementation and semiconductor manufacturing.
Companies developing industrial controllers, AI accelerators, automotive electronics, medical devices and connected products increasingly consider custom
From Gate Driver Architecture to Silicon Production
Developing a custom gate driver IC requires specialized expertise in analog and mixed-signal design, high-voltage semiconductor technologies, fast switching circuits, protection functions and power electronics.
Whether your application involves electric vehicles, GaN or SiC power converters, robotics, industrial motor control,
From Power Management Architecture to Silicon Production
Developing a custom Power Management Integrated Circuit (PMIC) requires specialized expertise in analog and mixed-signal design, voltage regulation, high-voltage semiconductor devices, power efficiency, and integrated circuit manufacturing.
Whether your application involves automotive electronics, AI data centers, robotics, industrial equipment, medical devices, or