Semiconductor Latest News

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AWS Chips Away at Nvidia’s Lead with Rising Demand for Custom AI Processors

Depositphotos

SEATTLE — June 18, 2025
Amazon Web Services (AWS) is seeing clear results from its ambitious custom silicon strategy, as growing adoption of its Trainium and Graviton chip families starts to erode Nvidia’s long-standing dominance in AI infrastructure.
 
In recent months, AWS has reported strong momentum for its internally

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Texas Instruments to Invest More Than $60 Billion to Strengthen U.S. Semiconductor Manufacturing

press release wafer fab

allas, TX — June 18, 2025 — Texas Instruments Incorporated (Nasdaq: TXN) today announced plans to invest more than $60 billion in building and expanding semiconductor manufacturing facilities in the United States—marking one of the largest investments in domestic chip production in American history.
 
The multiyear initiative will span

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X-FAB Expands 180nm XH018 Process with New Isolation Class for Enhanced SPAD Integration

press release gpt

Tessenderlo, Belgium – Jun 19, 2025

 

X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, has released a new isolation class within its 180nm XH018 semiconductor process. Designed to support more compact and efficient single-photon avalanche diode (SPAD) implementations, this new isolation class

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CAST Launches Multi-Channel DMA IP Core Ideal for Streaming Applications

press release

Woodcliff Lake, New Jersey — June 19, 2025 — Semiconductor intellectual property core provider CAST has introduced a new direct memory access (DMA) IP core that alleviates a system’s host CPU from the resource-intensive task of managing data transfers between system memory and multiple peripherals with streaming interfaces.
 
The

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Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry

June 17,2025 — SAN JOSE, Calif.— Cadence (Nasdaq: CDNS) today announced an expansion of its collaboration with Samsung Foundry, including a new multi-year IP agreement to broaden Cadence® memory and interface IP solutions in Samsung Foundry’s SF4X, SF5A and SF2P advanced process nodes. Furthering their ongoing technology collaboration, the companies are leveraging

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MIPS and Cyient Semiconductor collaborate to bring Custom RISC-V-based intelligent power solutions to AI Power Delivery, Industrial Robotics, and Automotive

press release gpt

San Jose, CA & Hyderabad, India- June 12, 2025: Cyient Semiconductors Private Limited, a fast-growing custom silicon company based in Hyderabad, and MIPS, a global leader in RISC-V processor IP, today announced a strategic collaboration to develop domain-optimized ASIC (application-specific integrated circuit) and ASSP (application-specific standard product) solutions that leverage

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Imec presents 150 GSa/s Digital-to-Analog Converter (DAC) achieving 300 Gb/s data transmission

news

LEUVEN (Belgium), JUNE 11, 2025— This week at the 2025 Symposium on VLSI Technology and Circuits, imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, and IDLab, an imec research group at Ghent University and the University of Antwerp, Belgium, announced a significant breakthrough in high-speed digital-to-analog conversion.

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Faraday Unveils FlashKit™-22RRAM: an eNVM-based SoC Development Platform for IoT

press release

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today introduced its latest FlashKit™ development platform, FlashKit™-22RRAM, designed to accelerate high-performance IoT and MCU applications. Built on UMC’s 22ULP process, FlashKit™-22RRAM combines embedded Resistive RAM (RRAM、ReRAM) technology with a rich IP ecosystem and development-ready support, providing a

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VeriSilicon’s Ultra-Low Energy NPU Provides Over 40 TOPS for On-Device LLM Inference in Mobile Applications

press release

Shanghai, China, June 9, 2025–VeriSilicon (688521.SH) today announced that its ultra-low energy and high-performance Neural Network Processing Unit (NPU) IP now supports on-device inference of large language models (LLMs) with AI computing performance scaling beyond 40 TOPS. This energy-efficient NPU architecture is specifically designed to meet the increasing demand for

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Tariff Effects and China Subsidies Soften 1Q25 Downturn; Foundry Revenue Decline Narrows to 5.4%, Says TrendForce

press release wafer

June 9, 2025 —- TrendForce’s latest investigations find that the global foundry industry recorded 1Q25 revenue of US$36.4 billion—a 5.4% QoQ decline. The downturn was softened by last-minute rush orders from clients ahead of the U.S. reciprocal tariff exemption deadline, as well as continued momentum from China’s 2024 consumer subsidy program.

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