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ELSYS Design, a leading international semiconductor and electronic systems design house, announces that it has formed a partnership with IAR Systems to bring additional benefits for its SoC and embedded system customers.
IAR Systems is the future-proof supplier of software tools and services for embedded development.
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Aldec, Inc., a pioneer in mixed-HDL language simulation and hardware-assisted verification for ASIC and FPGA designs, has utilized Aldec’s HES-XCVU9P-QDR UltraScale+ board with Tamba Networks 10G Ethernet MAC IP Core to deliver a proven Ultra-Low Latency (ULL) Ethernet solution that provides ~56ns roundtrip Ethernet latency using QSFP28 channels.
“High
Advanced eXtensible Interface, or AXI, is part of ARM’s AMBA specifications. The AXI is a point to point interconnect that designed for high performance, high speed microcontroller systems. The AXI protocol is based on a point to point interconnect to avoid bus sharing and therefore allow higher bandwidth and lower
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Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, and Avnet ASIC Israel Ltd. (AAI), a leading provider of ASIC and System on Chip (SoC) design solutions and turn-key design services, has announced a strong partnership in the fields of ASIC design and manufacturing services. This collaboration will
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Cyient Limited (“Cyient”), a global provider of engineering, manufacturing, geospatial, networks, and operations management services, today announced that its step down subsidiary Cyient Europe Ltd. has acquired AnSem N.V., a leading fabless, custom analog and mixed-signal application-specific integrated circuits (ASICs) design company. AnSem specializes in advanced analog, radio frequency, and
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The Advanced Microcontroller Bus Architecture (AMBA) is an on-chip interconnect that uses an open standard. The AMBA bus connects to and controls the management of peripherals and blocks designed for SoC or System-on-a-Chip. The development of the AMBA bus has had far reaching effects, including the creation of multi-processor designs
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Research included in the recently released 50-page April Update to the 2018 edition of IC Insights’ McClean Report shows that in 2017, the top eight major foundry leaders (i.e., sales of ≥$1.0 billion) held 88% of the $62.3 billion worldwide foundry market (Figure 1). The 2017 share was the same level as in 2016
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CMOS image sensor (CIS) sales are on pace to reach a seventh straight record high this year and nothing ahead should stop this semiconductor product category from breaking more annual records through 2021 (Figure 1), according to IC Insights’ 2017 O-S-D Report—A Market Analysis and Forecast for Optoelectronics, Sensors/Actuators, and Discretes.
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Innosilicon is proud to announce the expansion of our IP portfolio into GLOBALFOUNDRIES new 22nm FDX technology node. Innosilicon’s IP in 22FDX offers an excellent combination of performance, power consumption and ease of use that Innosilicon is known for.
“We have worked closely with GlobalFoundries for years to ensure
“Perception is reality,” we have heard this often. When an IC fails or the customer thinks that it failed, we must respond with an FA. Yet, to do that effectively, we must have accurate, pertinent information about the incident. That is the only way to avoid guesswork.
Let me