Semiconductor Latest News

IP-Maker to showcase NVMe Host demo at Flash Memory Summit

IP-Maker announces the availability of a NVMe Host reference design, to be showcased at Flash Memory Summit, in Santa Clara, on August 7 to 9. It highlights the integration of the NVMe Host IP from IP-Maker in a powerful FPGA, able to manage data transfer with a Gen3 x4 NVMe

The Ridiculously Smart Guide to Developing your own ASIC

Facebook is doing it, Google is doing it, even Amazon and Bosch are doing it. They have started designing ASICs (Application Specific Integrated Circuit, aka SoCs, ICs, chips). In fact, system companies are becoming the new ASIC designers and manufacturers. If you are a non-silicon company, this paper will help

CEO Talk: Karel Masařík

This interview was held with Karel Masařík, Founder and Chief Executive Officer at Codasip, Ltd.
 

 
Tell me a bit about your background. How did you first get started with your company?
 
Codasip was born a decade ago out of my PhD work at the Technical University of Brno. I

Sankalp Semiconductor Appoints Sathish Kumar Ganesan as Vice President Engineering

Sankalp Semiconductor, a design service company offering comprehensive digital & mixed signal SoC services and solutions, has appointed Sathish Kumar Ganesan in the key position of Vice President Engineering for IP Business. In this capacity, Sathish will be responsible for IP development and related engineering services. He has 16+ years

Amkor Delivers Industry’s First Package Assembly Design Kit to Support Mentor’s High-Density Advanced Packaging Tools

Amkor Technology announced today it has partnered with Mentor to release Amkor’s SmartPackage™ Package Assembly Design Kit (PADK), the first in the industry to support Mentor’s High-Density Advanced Packaging (HDAP) design process and tools. Amkor’s award-winning High-Density Fan Out(HDFO) process can now be used in conjunction with Mentor’s software to deliver

Open-Silicon and Credo Demonstrate Solutions for Deep Learning and Networking Applications at TSMC OIP and Symposium in Amsterdam

Open-Silicon, a system-optimized custom SoC solution provider and long-standing member of TSMC’s Value Chain Aggregator (VCA) and Design Center Alliance (DCA) programs, and Credo, a global innovation leader in Serializer-Deserializer (SerDes) technology, will participate in a joint demonstration at the TSMC 2018 Open Innovation Platform Ecosystem Forum and Technology Symposium in

Semiconductor Content in Electronic Systems Forecast to Reach 31.4% in 2018

In its upcoming Mid-Year Update to The McClean Report 2018 (to be released at the end of July), IC Insights forecasts that the 2018 global electronic systems market will grow 5% to $1,622 billion while the worldwide semiconductor market is expected to surge by 14% this year to $509.1 billion, exceeding the $500.0

Inomize to present a paper at TSMC OIP Forum in Amsterdam

Inomize, a leading Israeli design services company, will present a paper at TSMC OIP Forum in Amsterdam, The Netherlands on Monday 23rd July, as well as exhibiting at the OIP Forum and the TSMC Symposium on Tuesday 24th July.
 
Abstract: Based on TSMC 16n FFC automotive process design of a multi processors System on Chip to be part

HDL Design House Greece Joins HETIA

HDL Design House Greece, provider of digital, analog, and back-end design and verification services and products in numerous areas of SoC, announced membership of the Hellenic Emerging Technologies Industry Association (HETIA), an association of high tech industries to represent the dynamic Greek sector of semiconductors, micro- & nano- electronics.
 
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RoodMicrotec reports its strongest first half‐year sales in 7 years

RoodMicrotec N.V., the leading independent company for semiconductors supply and quality services, increased its half year sales by 17 percent year‐on‐year due to its strong ordering intake, especially in the areas Test Operations and Supply Chain Management. Within the markets, RoodMicrotec raised its sales in the industrial sector by 17