Get the semiconductor daily news directly to you by subscribing to our email list. For ASIC designer and managers, staying updated with the latest news, technologies, and trends is crucial. Here are the lastest news from the semiconductor industry.
LONDON, Feb. 14, 2024 — Reduced Instruction Set Computing (RISC)-V processor architectures are starting to address edge Artificial Intelligence (AI) workloads, and this trend is set to continue throughout the decade. According to a new report from global technology intelligence firm ABI Research, while RISC-V’s penetration into AI workloads is only just beginning,
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eDRAM Overview
A key factor in improving memory operations in System on Chips (SoC) is the use of embedded dynamic random-access memory (eDRAM), which means that the DRAM memory is inside the chip. This helps with enhancing the effectiveness and functionality of electronic products by reducing power consumption and
Portland OR – February 6, 2024 — Trilinear Technologies, a leading provider of cutting-edge technologies for display connectivity and semiconductor solutions, is proud to announce its strategic collaboration with key industry partners to support the integration of VESA’s DisplayPort Automotive Extensions (DP AE) into automotive systems. This initiative reflects Trilinear’s commitment
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iNPACK (a PCB Technologies Ltd. Company) and cutting-edge IC packaging and assembly house in Israel, in conjunction with ATS Engineering, a leading IC Test House based in Israel, have announced a transformative collaboration in order to establish the first Outsourced Semiconductor Assembly and Test (OSAT) facility in the Middle East. This pioneering venture aims to
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This interview was held with Michael Dube, Executive Vice President of Manufacturing Operations and Engineering of Rochester Electronics.
Tell me a bit about your background? How did you first get started with Rochester Electronics?
Sure, let me share a bit about my journey. I kicked off my
Faraday Technology Corporation (TWSE: 3035), a leader in ASIC design services and IP solutions, announces its collaboration with Arm and Intel in spearheading the development of a 64-core System-on-Chip (SoC) utilizing Intel 18A technology. This innovative SoC seamlessly integrates Arm® Neoverse™ Compute Subsystems (CSS), delivering unparalleled performance and power efficiency
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MILPITAS, CALIFORNIA, UNITED STATES, February 2, 2024 — SignatureIP, the pioneer of next generation NoC tools, has launched its new iNoCulator™ NoC configuration tool with a free trial period of two weeks for customers. The NoC (Network on Chip) is the backbone of a chip that provides the interconnect infrastructure between
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MILPITAS, CALIFORNIA, UNITED STATES, January 31, 2024 — Marquee Semiconductor, a global leader in chip design solutions, announces it has brought on semiconductor industry veteran Gideon Intrater as a Strategic Advisor. Mr. Intrater brings to Marquee more than 30 years of experience gained through technical, marketing and sales leadership roles at
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SANTA CLARA, Calif. – January 31, 2024 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced the successful tape out of the industry’s highest performing PHY solution for multi-die architectures, achieving bandwidth of 64Gbps/bump on a 3nm process using standard packaging. The
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SANTA CLARA, Calif., and TAIPEI, Taiwan, ROC, Jan. 25, 2024 – Intel Corp. (Nasdaq: INTC) and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced that they will collaborate on the development of a 12-nanometer semiconductor process platform to address high-growth markets such as mobile,
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