Semiconductor Latest News

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The future of Semiconductor Packaging, Assembly and Test in the European Semiconductor Eco-System

market

Since mid of last year, our member ESPAT-Consulting is dedicating significant resources to SEMI Europe GmbH in Berlin, Germany, as one of the seven consortium core members of the EU CHIPS ACT driven Horizon Europe – Chips Joint Undertaking (JU) – Coordination and Support Action (CSA) – Project Pack4EU (Link: https://pack4eu.eu/). He is asking

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YorChip, Inc. announces its first Chiplet for Edge AI applications with IP licensed from Semidynamics, the leader in RISC-V IP based in Barcelona

news

SAN RAMON, CA, 94582 — January 17, 2024 — YorChip, Inc. announces its first Chiplet for Edge AI applications with IP licensed from Semidynamics, the leader in RISC-V IP based in Barcelona. The Semidynamics High-Performance High-Bandwidth Quad Core IP with 4 Atrevido 423 with V8 SMD VPUs and T16 SMD Tensor

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Amkor and GlobalFoundries Cut Ribbon on Strategic Cooperation in Portugal

TEMPE, Ariz.–(BUSINESS WIRE)–Jan. 16, 2024– Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, and GlobalFoundries (GF), one of the world’s leading semiconductor manufacturers, will officially kick off their strategic partnership in Europe with a ribbon cutting ceremony at Amkor’s Porto, Portugal, facility on January 16, 2024.
 
Since February 2023, GF

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HaiLa Technologies Showcases First Wi-Fi-based Extreme-low-power Backscatter Chip, Developed in Partnership with Presto Engineering

LAS VEGAS—January 8, 2024—Today, HaiLa Technologies Inc., a fabless semiconductor and software company focusing on hyper power-efficient wireless communications system-on-chip solutions for IoT devices, announces availability of the BSC2000 RF Evaluation Chip Development and Demonstration Kits. Presto Engineering, a European leading expert in application-specific integrated circuit (ASIC) design, engineering, and

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VeriSilicon unveils the new VC9800 IP for next generation data centers

press release

Delivering exceptional throughput, AI-powered encoding, and superb image enhancement for data centers
 
Las Vegas, USA — January 8, 2024 — VeriSilicon (688521.SH) today unveiled its latest VC9800 series Video Processor Unit (VPU) IP with enhanced video processing performance to strengthen its presence in the data center applications. The newly launched

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Cadence Acquires Invecas to Accelerate System Realization

Transaction brings Cadence skilled system design expertise in delivering end-to-end custom solutions to customers across multiple industries
 
SAN JOSE, Calif.– January 08, 2024 — Cadence Design Systems, Inc. (Nasdaq: CDNS) announced today that it has acquired Invecas, Inc., a leading provider of design engineering, embedded software and system-level solutions, headquartered

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The Ultimate Guide eFPGA

Introduction to Embedded FPGAs
 

 
The embedded field-programmable gate array (eFPGA) technology has undergone significant evolution in recent years. eFPGAs serve as a programmable fabric in addition to conventional fixed-function components when they are directly integrated into application-specific integrated circuits (ASICs) or system-on-chips (SoCs). There are various benefits

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GLOBAL SEMICONDUCTOR CAPACITY PROJECTED TO REACH RECORD HIGH 30 MILLION WAFERS PER MONTH IN 2024, SEMI REPORTS

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MILPITAS, Calif. — January 2, 2024 — Global semiconductor capacity is expected to increase 6.4% in 2024 to top the 30 million *wafers per month (wpm) mark for the first time after rising 5.5% to 29.6 wpm in 2023, SEMI announced today in its latest quarterly World Fab Forecast report.
 

 
The 2024

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SkyWater Submits Application for US CHIPS and Science Act Funding to Modernize Equipment and Enhance Production at its Minnesota Facility

BLOOMINGTON, Minn. – January 2, 2024 – SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, today announced it has submitted a full application to the CHIPS Program Office of the U.S. Department of Commerce for funding through the CHIPS and Science Act. The application is for modernization and equipment upgrades to

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What does a Design For Test (DfT) Engineer do?

Design for Testability (DFT) engineer is an indispensable cornerstone within the semiconductor industry, providing a vital framework that ensures the reliability, efficiency, and cost-effectiveness of integrated circuits. Its primary objective revolves around embedding testability features directly into the design phase of these intricate circuits, thereby facilitating streamlined testing procedures, early

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