Semiconductor Latest News

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Covid-19 Expected to Limit Growth Rates For Many IC Products in 2020

IC Insights recently released its Mid-Year Update to The McClean Report 2020.  The update includes IC Insights’ ranking of revenue growth rates for the 33 IC product categories defined by the World Semiconductor Trade Statistics (WSTS) organization.
 
Figure 1 shows the distribution of growth rates for the 33 IC product categories in

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CAST HDLC/SDLC IP Core Now Ready for DO-254 Compliance in Airborne Systems

Woodcliff Lake, NJ — August 6, 2020 — Silicon intellectual property provider CAST, Inc. today announced a new version of its HDLC/SDLC IP core that helps avionics system developers achieve compliance with the DO-254 standard at the most stringent Design Assurance Level, DAL-A.
 
The new core variant was developed

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CEO Talk: Steve Beckers, VP at imec

This interview was held with: Steve Beckers, VP at imec
 

 
Tell me a bit about your background. How did you start at imec/imec.IC-link?
With 37 years in the semiconductor industry, I consider myself a veteran. I started my career at Alcatel Microelectronics in 1983 and worked there

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Faraday Launches Ariel™ SoC Platform with Infineon’s SONOS eFlash to Drive IoT Development

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today launched its next generation IoT SoC development platform, called Ariel™, which is built on UMC’s 40uLP logic process combined with Infineon’s SONOS eFlash technology. Compared with its predecessor, the 55nm Uranus+™ platform, the Ariel platform demonstrates a 35% reduction

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Presto Engineering Moves to New Facility in Caen for Enhanced Engineering and Production Capabilities

CAEN, France – July 13, 2020—Presto Engineering, an ASIC design and outsourced operations provider to semiconductor and Internet of Things (IoT) device manufacturers, announced today the grand opening of its new Caen Hub in France. The facility will provide IC test, qualification, and test production services primarily for communications, automotive,

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Talking Sense with Moortec… Staying on the right side in worst case conditions – Power (Part 1)

In this first part of a 2-part blog series, we look at defining worst case conditions, focusing specifically on device power.
 
With great power, comes great responsibility…
With each new technology node especially FinFET, the dynamic conditions within a chip are changing and becoming more complex in terms of process

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Wafer Capacity 2019 By Region

In its Global Wafer Capacity 2020-2024 report, IC Insights breaks down the world’s installed monthly IC wafer capacity by geographic region (or country).  Figure 1 shows the installed IC capacity by region as of December of 2019.
To clarify what the data represents, each regional number is the total installed monthly

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Phison appoints T2M-IP for global marketing, representation, and business development

Phison, the market leader in NAND Flash controllers chips and IPs for SSD, PCIe, SD, eMMC, ONFi, UFS & USB Consumer, Embedded & Enterprise applications has signed an agreement with T2M-IP, the world’s largest independent global semiconductor IP provider, to act as a global representative and business development partner of

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IC’Alps launches its new website for Application Specific Integrated Circuits design & supply activities

Meylan, FRANCE – June 22, 2020 – IC’Alps, French expert in design and supply of application specific integrated circuits (ASIC), today announced the launch of its new website.
 
https://www.icalps.com is a one-stop destination for microelectronics experts and newbies with a product innovation requiring integration of electronic functions. The website

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Understanding IC Package Thermal Characteristics

BGA

One of the most common factors that can have a lasting impact on any given semiconductor device is heat. Any logic circuit or electronic device requires a power supply to drive the function of its parts. While most of this power is used up for basic logic functions and signal

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