Semiconductor Latest News

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Moortec Provide Embedded Monitoring Solutions for Arm’s Neoverse N1 System Development Platform on TSMC 7nm Process Technology

Moortec today announced the delivery of its In-Chip Monitoring solution on TSMC 7nm FinFET process to the new Arm® Neoverse™ N1 System Development Platform (SDP). As market leaders, Moortec supported integration and utilization of its process, voltage, and temperature (PVT) sensing subsystem technology to the platform, enabling the next-generation cloud-to-edge

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1Q19 Registers the 4th Largest Sequential IC Market Decline on Record

IC Insights will report on and examine the 1Q19 worldwide IC market results in its May Update to the 500-page, 2019 edition of The McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry next month.
 
From 1Q84 through 1Q19 there have been 141 quarters, and only seven of them registered an

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Tamba Networks’ IP Selected for Innovium’s TERALYNX 12.8 Tbps Data-Center Optimized Switch

The low latency leader for semiconductor IP, announced today that Innovium, a leading provider of networking solutions for data centers, selected Tamba Networks’ IP for its TERALYNX 12.8 Terabits/sec Ethernet switch, which is in production and has been selected by multiple leading OEMs, ODMs and hyperscalers.
 
“Innovium’s TERALYNX data-center

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CEO Talk: Richard Visee, SystematIC

This interview was held with Richard Visee, CEO of SystematIC.
 

 
Tell me about SystematIC Design?
 
We design and supply integrated chips (IC) customized to our clients’ need. We have a unique track record of innovations in analog heavy mixed signal IC designs (big A small

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ON Semiconductor and GLOBALFOUNDRIES Partner to Transfer Ownership of East Fishkill, NY 300mm Facility

PHOENIX & SANTA CLARA, Calif.–(BUSINESS WIRE)–Apr 22, 2019–ON Semiconductor Corporation (Nasdaq: ON ) (“ON Semiconductor”) and GLOBALFOUNDRIES today announced that they have entered into a definitive agreement for ON Semiconductor to acquire a 300mm fab located in East Fishkill, New York. The total consideration for the acquisition is $430 million, of

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Faraday Unveils RISC-V ASIC Solution to Support Edge AI and IoT SoCs

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today revealed that its RISC-V based ASIC platform solution has been successful in the design and mass production of next-generation edge AI and IoT system-on-chips (SoCs). This solution encompasses full system-level design services, such as RISC-V core

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Attopsemi’s I-fuse OTP Passed 3 lots of HTS and HTOL Qualification for 1,000hr on GLOBALFOUNDRIES 22FDX FD-SOI Technology

Attopsemi, an OTP IP provider, announced today that the company’s 256Kb OTP (One-Time Programmable) IP, manufactured on GLOBALFOUNDRIES (GF®) 22FDX® technology, passed 3 lots of 150°C HTS and and 125°C HTOL for 1,000 hours following the JEDEC standards. Not only all 120Mb in 3 lots of HTS/HTOL passed functionally, the

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CEO Talk: George Dimitropoulos of ADVEOS

This interview was held with George Dimitropoulos, CEO of ADVEOS.
 

 
Tell me about ADVEOS
 
ADVEOS was founded in 2015, and is a privately-held fabless company, providing ASIC design services and developing RF and analog IP cores. Adveos supports a growing international customer base, designing various technology products

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Proven technology significantly reduces risk, time-to-market and overall cost

Belgium, April 8, 2019 – Sofics bvba (www.sofics.com), a leading semiconductor integrated circuit IP provider announced that it has expanded its TakeCharge® Electrostatic Discharge (ESD) and Analog IO portfolio with solutions for the TSMC 7nm FinFET process. Sofics has already verified its TakeCharge Analog IO’s and

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TSMC and OIP Ecosystem Partners Deliver Industry’s First Complete Design Infrastructure for 5nm Process Technology

TSMC today announced delivery of the complete version of its 5 nanometer (nm) design infrastructure within the Open Innovation Platform® (OIP). This full release enables 5nm systems-on-chip (SoC) designs in next-generation advanced mobile and high-performance computing (HPC) applications, targeting high-growth 5G and artificial intelligence markets. Leading Electronic Design Automation (EDA)

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